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143 Threads found on edaboard.com: 6 Layer Stack Up
2 outer layers plus 6 inner signal layers. Others are all ground and power layers.
The layer stack up (4 layers) is as below TOP layer CORE GND PLANE PREPREG POWER PLANE CORE BOTTOM layer. The other layer stack up (4 layers) is as below TOP layer PREPREG GND PLANE CORE POWER PLANE PREPREG BOTTOM (...)
I sent my previous queries regarding the PCB layer stack up and thickness of core and prepreg. I got a common reply - the PCB Manufacturer will prepare the same. How can the PCB Manufacturer prepare the PCB layer stack up and determine the value of thickness of core and prepreg? Is the forum for the PCB Manufacturer (...)
i designed in such a way that all signal layers are guarded by power supply or gnd planes.... example: 1)TOPlayer 2)GND 3)signal1 4)power1 5)signal2 6)power2 7)signal3 8)bottom layer
Hi all, Can anybody pls tell, What is the effect of Unbalanced layer stack up ? or sometimes it is required to unbalance the Core or prepage thickness for some Desing requirements? And what is the difference if We use Core in center or we use Prepage in center .because somedody told me that we shuld use like Top layer CORE (...)
Can any body help me How to decide layer stack up in Multi layer designing?
Now I want to design a PCB which has two RF chips on it. Also, there are some high speed digital components, a 6 layer board is needed. Is the layer stack setting correct for this design? 1. RF signal 2. ground 3. Baseband signal 4. power 5. ground 6. Baseband signal
I am designing a layout with 8 layer with some EMI/EMC considerations. First of alll classical 4signal+4plane approach is not suitable for us, since the 4 signal layer is not enough. Also i can not increase number of layers up to 10 because of cost consideration. Another stack up 6signal+2plane may cause us with EMI/EMC (...)
Hi All In my design I have 7 power supplies (1.2, 1.5, 1.8, 2.5, 3.3, 5, -5). I am using the following layer stack up. top gnd power 1 (split plane for 1.5, 5) signal 1 signal 2 power 2 (3.3 V) power 3 (split plane for 2.5,-5) signal 3 signal 4 power 4 (split plane for 1.8, 1.2) gnd bottom Most of the signals with frequency 5
Attached here is the chip that I'm designing right now and I need some suggestion for layer stack up that I can use for this chip & blind & buried via layer combinations. Thank you.
Hi all, i need help with stack up 8 layer board with controlled impedance 50 ohm (+-10%) on all layers for 0.125mm tracks. Can you help me please ? board thickness 1.6mm. The stack up is : ------signal ------GND ------signal ------VCC ------GND (signal) ------ signal ------VCC ------signal Thank you in advanced !
Hi Everyone, I am facing a problem in ORCAD 9.10.I am designing a 4-layer board and using top-->gnd-->pwr-->bot as my stack up.But ORCAD has given me this stack up top-->bot-->pwr-->gnd which is the default.I am not able to change the layers in ORCAD.I am attaching a snapshot of layers
Hi! Structure of my PCB stack up: L1--^---^--- SIG L2----------- GND L3--^---^--- SIG/PWR L4--^---^--- SIG/PWR L5----------- GND L6--^---^--- SIG on L1/L6 assembled BGA (DDR2,FPGA) with pitch 0.8mm, so i need route aproximately 0.1/0.1 (line/clr.) and VIA about 06/03 or 05/02 L1/L3/L4/L6 single - 50ohm, diff - 100ohm
hi, go to drafting -->2D line and then draw line like that in drill drawing layer
Hi , I am designing 24 layer card with 1GHz having 12 BGAs , Is there any guideline for layer stack up for BGA Thanks Ashwin
Hi Cadstar have really nice layer stack editor but i still not find a way to put that info into the gerber or documetation drawing ? still have solution to make it by hand and put it on templace but i sure zuken not put lot of tome for make great layer stack up editor and forgot way to put it on output file (...)
Hi,freinds here, I met with a problem when using PowerPCB4.0,that is: I am designing a 8-layer board,when using the autoroute function,it dosn't route in the inner signal layers,what's wrong with it? My PCB layer stack-up is: 1.Top layer 2.GND (...)
Hi Folks, I have a doubt in multi layer PCB. Should we increase the via and through hole component's pads size in inner layer than outer layers? If yes means could anyone explain me about for what we should do? Any help would be greatly appreciated. Thanks in advance. -Rajkumar
Hi everyone, What is best stack up for a 12 layer PCB. Does the following hold good Type layer SIGNAL - layer 1(Top) GROUND - layer 2 SIGNAL - layer 3 SIGNAL - layer 4 GROUND - layer 5 POWER - layer 6 POWER - (...)
I am using the following 6 layer stackup for a wireless system module design based on a reference chipset in 2.5 Ghz and the layout recomendation is to have a solid ground plane as ground for digital,analog sections TOP 0.05 mm copper foil+copper plating DIELECTRIC 0.1016 mm 4 mil Core LAY2 0.035 mm 1 oz Solid Ground DIELECTRIC 0.1016 mm
I'm no an expert, but it looks good, I would recomend the FR408 though. if you are having 3GHz, I'm assuming you will have up to 6Gbps, so a low loss tan material would be better. hope it helps.
So I'm trying to route an RF device, but do the complexity of the device, I can't route the RF on a single layer. I know routing RF on separate layers will loose a little bit of performance, but at this point it's my only option. Will the following stack up minimize the lost? RF SIGNAL GND SIG1 SIG2 GND RF SIGNAL Would it be (...)
I Undetstand that following will be the stack up in case of 6 layers Top Gnd Signal-1 Signal-2 Vcc Bot 1) Is my assumption right? 2) Have you used the BGA of this count? 3) What is the stack-up you used in 6 layer for BGA of 484 balls 0.8mm pitch? Thanks
Never got a reply in the professional hardware forum, so I'll ask here: I'm making a board with a Spartan-6 and DDR2 RAM. The 256 ball BGA escape can be done with only 4 layers, but the price difference between 4 and 6 layers from PCBcart isn't that high. I saw this six-layer
hi prastesh, thanks for your reply. but i think your are not understand my ?? please see that file, in this board is 6 layer board file,when i click this layer stack up it is shows as class:maufacturer sub class :layer stack up how it is come ??
I already asked a very specific question regarding this subject on this thread: However i am looking for a more generic answer here. I have looked around and seems to exist many variations on pcb stack up for a 4 layer boards. However i could not find some real comparison between all the possible combi
Dear all, In 4 layer PCB usually we are using stack up as Signal-VCC-GND-Signal. My question is that if we swap VCC & GND then what will happen. If we can do that one then which kind type of problem arise. (new stack up Signal-Gnd-VCC-Signal) is it advisable??? Pls rely me on asap. Thanks Vimal Patel
Hi, any one explain clearly about how to calculate layer stackup ...considering the pin density and number of power plane,,,suppose i am using 2000 pin fine pitch bga which is 6 numbers in board..what would be the number of layer ? and why? Praveen:!:
Hi, I have to design a 6 layer board with Altium Designer software. Well, in this board I have : -Power: 1.2V , 1.8V and 3.3 V -GND -Digital signals. This board is based on a DSP with the maximum frequency of 600 MHz. Can any one help me how to make the stack-up of my six-layers. Well I read bofore that I'm able to use (...)
I think the best option is to use Pwr/Signal/Signal/Gnd to keep the paths between GND Plane and signal layers as short as possible. Do you agree with me? Best Regards! Hi Inka, The both are OK from my humble opinion. PWR/GNDs at outside layer are always the best for shielding purposes, but reworking of board woul
hi robis, top layer and bottom layer is signal layer if want to design 2 layer top and bottom is enough no need to assign extra layer like ground or power (planes). usually layer are assign in multiplication of 2 like 2 layer,4 layer, 6 (...)
I've made lots of designs using Rogers + FR4 stackups and I've always been advised to make the layer stack symmetrical or the board can warp. So a typical design might be 0.020" Rogers on layer 1 then a 4 layer FR4 core and then another 0.020" Rogers layer on the bottom (...)
You could look at the sample layer build-ups: Their suggested 8 layer build-up results in a nominal 1.6mm PCB I think. Keith
Hi, How could a PCB designer determine the PCB stackup and Impedance of the board if the customer or manufacturer didnot mention anything about it? Is there any standard stackup and impedance for the PCB board? How much thickness should be set for each layer? core or prepeg values should be in how much thickness? What (...)
Hi guys iam very new to design multilayer boards. what is the layer stackups for 10 and 12 layers.if anyone knows please help me. thankyou
Hi, can someone please tell me how I have to set up the layer stack in PCAD for a single(!) layer pcb. There seems to be no problem to set up 2 or more layer pcbs but I'm not able to get rid of the "top"-layer. Perhaps soemone could give me a clue - or just post a simple 1 layer sample (...)
I've read recommended stack-up configurations, mostly using S-G-P-S configurations. There are some which use the more unconventional S-P-G-S stack-up, the reason being components have taken up much of the routing space on the toplayer. Am I right to say that the ground plane should be closest to the signal plane with a higher routing (...)
have two years Exp.pcb layout for mobile phone & other boards be used with communications 6~18 layer stack up BGA pin pitch form 0.5mm to 1.27mm perhaps I want to look for a job. Somebody help me? tools EDA:Mentor EN DFM:Valor
Iam very new to pcb design & i want to know, is there any rule for pcb layer stackup, like, is it necessary for a signal layers need an adjacent plane layer etc.
What is the most professional PCB routing software? What PCB routing tool should I master to get a job in PCB routing? Now I use Pcad 2002 and Proteus.
Usually a series (source) termination is adviced, but not always. When U design a small board, with short traces, and not to route any hi-speed signal to connectors, maybe you do not need any termination until 150-200MHz. There are working reference designs with 133MHz SDRAMs and without any termination. Parallel (end) termination is rearly req
Hello, Recently I received a PCB stackup design from my client that I feel the design is very odd, but I'm not sure whether the design can be fabricated or not? please refer in the following enquiries: 1) Client intended to use 3 layers(1 copper foil +1 core with 1oz of copper at top and bottom) to form a lamination prior to generate the buri
Dear All; I needed new PCB fabricators that can fabricate 28 layers PCB? in china or taiwan Thanks
Hi, my name is kook and I am new to this forum and this antenna area. I am to design a microstrip patch antenna in multi-layer stack-up. Here is how it looks like. I have 6 metals (M1 to M6) and 5 dielective substrates. Each metal has a thickness of 0.7 mils, and its width and lengh are not determined yet. M1 er = 3.38, loss tan = 0
the below link has the evaluation board pdf with eight layer stackup details u can find the layer arrengements. while goin for multilayer board u have to find the impedance for the high speed signals etc...
Dear All; After I finish the 12 layer board in Allegro I need to rearrange the layers stackup, How can I do that?
The stack is a manufacturing house problem. You should *never start routing * without talking before with your PCB house, asking them if your stack proposal is manufacturable. Any multilayer board could be manufactured with different sublaminate scheme. You must dimension carefully the vias tipe for different sublaminations. Example: * (...)
Hello btbass, thanks for the reply. The fastest signals are from the processor to DDR-266 RAM so the clock is 133MHz on two phases. The rise time is probably quite short on the clock signals (probably less than 1ns). The longest trace from processor to RAM is about 44mm and the trace thickness is 4 mils on IN1 and 5 mils on other layers. Ther
Thanks for the help. In our pcn stack up, The copper base thickness on each layer ? 0.5 oz or 0.6693 mils. Finished copper thickness on each layer ? 1.25 oz (i.e. 0.5 oz+ 0.75 oz) or 1.722 mils. Our pcb board thickness is 5mm The single ended trace impedance on all signal layers must be a min of 60 ohms and a (...)
Hi all i have a 8 layer board problem. its an mcu board with tis chip IC, MCU, MC9328MX21 -MAPBGA-17x17-289pins frm freescale, a couple of DRAM, Flash, Lan chip etc. When i change the address n data to different layer its not werking well. there is no movement in components. Any one can advise? Top component - MCU chip & 2xSDRAM Bottom