Search Engine

6 Layer Stack Up

Add Question

1000 Threads found on 6 Layer Stack Up
2 outer layers plus 6 inner signal layers. Others are all ground and power layers.
The layer stack up (4 layers) is as below TOP layer CORE GND PLANE PREPREG POWER PLANE CORE BOTTOM layer. The other layer stack up (4 layers) is as below TOP layer PREPREG GND PLANE CORE POWER PLANE PREPREG BOTTOM (...)
I sent my previous queries regarding the PCB layer stack up and thickness of core and prepreg. I got a common reply - the PCB Manufacturer will prepare the same. How can the PCB Manufacturer prepare the PCB layer stack up and determine the value of thickness of core and prepreg? Is the forum for the PCB Manufacturer (...)
i designed in such a way that all signal layers are guarded by power supply or gnd planes.... example: 1)TOPlayer 2)GND 3)signal1 4)power1 5)signal2 6)power2 7)signal3 8)bottom layer
Hi all, Can anybody pls tell, What is the effect of Unbalanced layer stack up ? or sometimes it is required to unbalance the Core or prepage thickness for some Desing requirements? And what is the difference if We use Core in center or we use Prepage in center .because somedody told me that we shuld use like Top layer CORE (...)
Can any body help me How to decide layer stack up in Multi layer designing?
I am designing a layout with 8 layer with some EMI/EMC considerations. First of alll classical 4signal+4plane approach is not suitable for us, since the 4 signal layer is not enough. Also i can not increase number of layers up to 10 because of cost consideration. Another stack up 6signal+2plane may cause us with EMI/EMC (...)
Hi all, i need help with stack up 8 layer board with controlled impedance 50 ohm (+-10%) on all layers for 0.125mm tracks. Can you help me please ? board thickness 1.6mm. The stack up is : ------signal ------GND ------signal ------VCC ------GND (signal) ------ signal ------VCC ------signal Thank you in advanced !
Hi Everyone, I am facing a problem in ORCAD 9.10.I am designing a 4-layer board and using top-->gnd-->pwr-->bot as my stack up.But ORCAD has given me this stack up top-->bot-->pwr-->gnd which is the default.I am not able to change the layers in ORCAD.I am attaching a snapshot of layers
hi, go to drafting -->2D line and then draw line like that in drill drawing layer
Now I want to design a PCB which has two RF chips on it. Also, there are some high speed digital components, a 6 layer board is needed. Is the layer stack setting correct for this design? 1. RF signal 2. ground 3. Baseband signal 4. power 5. ground 6. Baseband signal
Hi All In my design I have 7 power supplies (1.2, 1.5, 1.8, 2.5, 3.3, 5, -5). I am using the following layer stack up. top gnd power 1 (split plane for 1.5, 5) signal 1 signal 2 power 2 (3.3 V) power 3 (split plane for 2.5,-5) signal 3 signal 4 power 4 (split plane for 1.8, 1.2) gnd bottom Most of the signals with frequency 5
Attached here is the chip that I'm designing right now and I need some suggestion for layer stack up that I can use for this chip & blind & buried via layer combinations. Thank you.
Hi! Structure of my PCB stack up: L1--^---^--- SIG L2----------- GND L3--^---^--- SIG/PWR L4--^---^--- SIG/PWR L5----------- GND L6--^---^--- SIG on L1/L6 assembled BGA (DDR2,FPGA) with pitch 0.8mm, so i need route aproximately 0.1/0.1 (line/clr.) and VIA about 06/03 or 05/02 L1/L3/L4/L6 single - 50ohm, diff - 100ohm
Hi , I am designing 24 layer card with 1GHz having 12 BGAs , Is there any guideline for layer stack up for BGA Thanks Ashwin
Hi Cadstar have really nice layer stack editor but i still not find a way to put that info into the gerber or documetation drawing ? still have solution to make it by hand and put it on templace but i sure zuken not put lot of tome for make great layer stack up editor and forgot way to put it on output file (...)
I'm looking for stack up recommendations (keeping in mind readily available materials) for a 6 layer board I'm working on. Design requirements dictate the following: - maximum 6 layers - lots of high speed traces DDR3, SERDES, Gbit ETH, USB2.0 etc - high speed signals due to BGA need to be 4mils wide So for 50/100Ohm with 4mil (...)
Hi everyone, What is best stack up for a 12 layer PCB. Does the following hold good Type layer SIGNAL - layer 1(Top) GROUND - layer 2 SIGNAL - layer 3 SIGNAL - layer 4 GROUND - layer 5 POWER - layer 6 POWER - (...)
Hi, I have to design a 6 layer board with Altium Designer software. Well, in this board I have : -Power: 1.2V , 1.8V and 3.3 V -GND -Digital signals. This board is based on a DSP with the maximum frequency of 600 MHz. Can any one help me how to make the stack-up of my six-layers. Well I read bofore that I'm able to use (...)
I'm no an expert, but it looks good, I would recomend the FR408 though. if you are having 3GHz, I'm assuming you will have up to 6Gbps, so a low loss tan material would be better. hope it helps.
So I'm trying to route an RF device, but do the complexity of the device, I can't route the RF on a single layer. I know routing RF on separate layers will loose a little bit of performance, but at this point it's my only option. Will the following stack up minimize the lost? RF SIGNAL GND SIG1 SIG2 GND RF SIGNAL Would it be (...)
I Undetstand that following will be the stack up in case of 6 layers Top Gnd Signal-1 Signal-2 Vcc Bot 1) Is my assumption right? 2) Have you used the BGA of this count? 3) What is the stack-up you used in 6 layer for BGA of 484 balls 0.8mm pitch? Thanks
I already asked a very specific question regarding this subject on this thread: However i am looking for a more generic answer here. I have looked around and seems to exist many variations on pcb stack up for a 4 layer boards. However i could not find some real comparison between all the possible combi
Dear all, In 4 layer PCB usually we are using stack up as Signal-VCC-GND-Signal. My question is that if we swap VCC & GND then what will happen. If we can do that one then which kind type of problem arise. (new stack up Signal-Gnd-VCC-Signal) is it advisable??? Pls rely me on asap. Thanks Vimal Patel
I think the best option is to use Pwr/Signal/Signal/Gnd to keep the paths between GND Plane and signal layers as short as possible. Do you agree with me? Best Regards! Hi Inka, The both are OK from my humble opinion. PWR/GNDs at outside layer are always the best for shielding purposes, but reworking of board woul
Hi, Initially We designed a board for 2-6 GHz band application. It used 4-layer FR4 PCB material. Its performance in 4-6 GHz band was very worst. It had very high dielectric losses at such high frequency. Taking into account this consideration, now We have optimized the design. We are planning to use hybrid stack-up ( Rogers R04003 8 mi
You could look at the sample layer build-ups: Their suggested 8 layer build-up results in a nominal 1.6mm PCB I think. Keith
Hello, I wanted to place a stackup legend on my design files. It puts a nice bracket, it names the layers aaand.. that's about it. Details are filled in in the layer manager (obviously) and I enabled all options when I 'tabbed' after placing first corner. Seems I did just about everything as mentioned in (...)
Impedance Calculation and Multilayer PCB stack-up design info available in the following link. Very useful, DrBELL
Hi,freinds here, I met with a problem when using PowerPCB4.0,that is: I am designing a 8-layer board,when using the autoroute function,it dosn't route in the inner signal layers,what's wrong with it? My PCB layer stack-up is: 1.Top layer 2.GND (...)
Please suggest a minimal configuration of layer stack for a 16-bit mixed analog-digital design, low speed and very small signal (uA..mA). It's enough a 2-layers board with GND/power on these two layers among signal traces; or it is necessary to have internal GND/power planes? Thanks
If I used two grounds to sandwich a high speed signal layer. Should I keep the distance of the signal layer to each ground be even or not ? Thanks.
Hi Folks, I have a doubt in multi layer PCB. Should we increase the via and through hole component's pads size in inner layer than outer layers? If yes means could anyone explain me about for what we should do? Any help would be greatly appreciated. Thanks in advance. -Rajkumar
Hi, Anybody can give me the OFF the SHELF materials in PCB stack-up creation. Thanks, tdt
The layer stack is specified in the layer stack Manager. I found myself manually have to draw the layer stack into a text file because i couldn't find any way to generate the layer stack configuration based on the information specified in the (...)
Can one or more experts please briefly describe the general layer stack for decals? I am working in/fighting with PAD$ 2005 SP2 and I've constructed several basic shapes that have a top copper. Many times this non-electrical shape is converted to silk because its on a surface layer but sometimes I've created a polygon in the silkscreen (...)
I am using the following 6 layer stackup for a wireless system module design based on a reference chipset in 2.5 Ghz and the layout recomendation is to have a solid ground plane as ground for digital,analog sections TOP 0.05 mm copper foil+copper plating DIELECTRIC 0.1016 mm 4 mil Core LAY2 0.035 mm 1 oz Solid Ground DIELECTRIC 0.1016 mm
any body have any PCB stack-up guidelines e-book and trace impedance calculation tool please upload it.
Never got a reply in the professional hardware forum, so I'll ask here: I'm making a board with a Spartan-6 and DDR2 RAM. The 256 ball BGA escape can be done with only 4 layers, but the price difference between 4 and 6 layers from PCBcart isn't that high. I saw this six-layer
hi prastesh, thanks for your reply. but i think your are not understand my ?? please see that file, in this board is 6 layer board file,when i click this layer stack up it is shows as class:maufacturer sub class :layer stack up how it is come ??
As Fvm as stated there is no easy answer, there is a lot to learn. Just to add some points.. 1. Impedance control requirement 2. Routability- approximately a 12 X 12 array of BGA can be routed in a 6 layer card (a thumb rule) 3. Number of power rails 4. Performance specs of the PCB- EMC in specific 5. Allowed
Hi all , i am go to design TMS320C5505 fixed point signal processor board i have the schematic but i don't know how to built stack-up for this schematic which contain linear regulator ,UART, JTAG ,connector USB ,LCD and Ultra Low Power Stereo Audio Codec are the peripheral . to built stack-up ,depends on pin counting or depends on nets
hi robis, top layer and bottom layer is signal layer if want to design 2 layer top and bottom is enough no need to assign extra layer like ground or power (planes). usually layer are assign in multiplication of 2 like 2 layer,4 layer, 6 (...)
Hello, I?m an interested reader for a long time, but this is my first entry. Sorry for my rusty English, but I will do my best. I have the following question: I have to design a pcb with 6 layers. The outer layers are reserved for signal routing. The inner layers are for the symmetrical power supply of the board. That mean?s 2 inner (...)
I have a differential 8GHz signal routed on RF top layer. I need controlled 100 impedance lines on the top layer. Dear, Your RF board have high power amplifier or microstrip filter circuits? If no,just use RF-4.
have two years Exp.pcb layout for mobile phone & other boards be used with communications 6~18 layer stack up BGA pin pitch form 0.5mm to 1.27mm perhaps I want to look for a job. Somebody help me? tools EDA:Mentor EN DFM:Valor
What is the most professional PCB routing software? What PCB routing tool should I master to get a job in PCB routing? Now I use Pcad 2002 and Proteus.
Usually a series (source) termination is adviced, but not always. When U design a small board, with short traces, and not to route any hi-speed signal to connectors, maybe you do not need any termination until 150-200MHz. There are working reference designs with 133MHz SDRAMs and without any termination. Parallel (end) termination is rearly req
Hi, my name is kook and I am new to this forum and this antenna area. I am to design a microstrip patch antenna in multi-layer stack-up. Here is how it looks like. I have 6 metals (M1 to M6) and 5 dielective substrates. Each metal has a thickness of 0.7 mils, and its width and lengh are not determined yet. M1 er = 3.38, loss tan = 0
Hello btbass, thanks for the reply. The fastest signals are from the processor to DDR-266 RAM so the clock is 133MHz on two phases. The rise time is probably quite short on the clock signals (probably less than 1ns). The longest trace from processor to RAM is about 44mm and the trace thickness is 4 mils on IN1 and 5 mils on other layers. Ther