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1000 Threads found on edaboard.com: Bondwire Model
How can we extract the package (bondwire) model after testing the chip? If not, how to modify the LNA VCO design for the next tape-out?
Dear all, I design a LNA. Firstly, I don't added any bondwire effect (1nH in series with 1ohm to pretend a bondwire) on each pad for the simulation. Afterwards, I added the bondwire model at each pad and do the simulation again. I found the NF is 3dB higher compared to the LNA without bondwire (...)
Hello everybody! Is there a possibility to simulate the inductivity and other effects of bondwires in ADS Momentum? The bondwires from my chip down to the microstrip line on the substrate are about 1mm long. But there is only direct current. thanks in advance, Gunar
Hi, new version of this wonderful software is just released Some of the highlights include: - 3D Graphs - Edit-in-place for layouts - Support for multi-element editing - New extraction/optimization methodology for EMSight - New bondwire model and many other new models - Integration of Zeland's IE3D in the EMSocket (...)
If i have 1mm of bondwire, its approx 1nH of inductance. what if i have 2 bondwires right next to each other connected to the same pad, what is the approximate inductance ? (theres going to be some mutual inductance). Thanks.
hello Lagos.ji, You don't need to look this up from a book. The packaging information from you resource should provide you the resistance of a bondwire per unit length. Add that to your bondwire model on series with the inductance. This is simply the metal resistance so will be quite small but would damp out your ringing sufficiently. (...)
Because of the large current of power amplifier,I want to run the simulation with package & bondwire parasitic parameter. But I wonder how to model the parasitics?Could anyone offer some exampls? Thanks!
A packaged chip need receive a high frequency(1.1GHz),sine wave,low swing(peak to peak=0.3v) signal from external. How to consider the IO pad's equivalent model including bondwire(Au wire between analog pad and pin) and analog pad in chip? My design is based on TSMC0.25 mixed signal process, what are the parameters of this IO pad's equivalent (...)
My package contains 3D bondwire structure and 2D microstrip structure. How can I get the model of 3D bondwire structure ? by what tool ?
Indeed this is a hard thing to do, you only have S11,S21,S21 and S22 measurements although at different freqs, and many parameters to tweak ... To find approximations for the extrinsic components I would refer to the package parasitics. The length of the bondwire etc depends on the physical structure of the package and can be approximated. That'
How to modeling the bondwire and the wire on the PCB when i design a lvds driver. Should i use a ibis model?
Can any one have SMA edge board connector model in CST or HFSS. or the meterial parameter and dimension of the SMA edge board connector? thank you. Added after 5 hours 22 minutes: and how to draw a bonding wire in HFSS, not using the provided tool in HFSS. I mean a random wire, not set with data input? [
I am a freshman in some questions here. Why bondwire is suitable to connect transmission line with MMIC Chips? what is the effect of connection,and common circuit model of it? Any good refences? Thanks Liu
Hai How to model in LNA in EMDS of ADS 2009 version...However in youtube its video available...But there it is not given how to get bondwire kit.... Can any one work on it,...If yes tell me...i am waiting for it...Waiting for your quicker reply....
Hi! Does anybody could tell what is a practical minimum value for the bondwire inductance? i'm working at 2.4 GHz and 90 nm technology. thanks PS: if you know typical pad capacitance value will be also very helpfull ;)
Does any converter exist? OR any document explining how to do it manualy ?
On 2001-08-19 17:21, xtecer wrote: Oh I am intreasting the Topic ,too.... But I am a new one..>^^ Hello, Yes, I'm starting to use ADS for RFIC design. So far, I needed to model the bondwire's inductance and mutuals-had to use HFSS to get the spars and the used the spars like a black box. I'm also trying to extract a bsi
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