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44 Threads found on edaboard.com: Chip Model Package
for power amplifer design, you should using package & bandwire model in simulating. because you need adjust the output impedance (impedance matching) chip test doundry would offer you package model.
Care: The s parameter can obtain from the DATA sheet or the EDA soft lib.And mean the linear lib. For the BJT,there are two type of you must be care to use it.One is the chip and it do not include the pakage model ,the other is the pakage DATA. The other you must care is the reference plane for the S dembed.You must use the same reference plan
You can't check DDR SDRAM interface timing using STAMP models, or any other Primetime models for that matter. In order to get good results the IO timing needs to be simulated using a good model of the bonding wire, package trace and board trace behaviour, using spice in order to determine if the IO timing is met. (...)
Hi, guys I am a beginner in FPGA. There is a develop board on my hand. chip model is SPARTAN XC2S200 In attached CD, there is a software, MicroBlaze IDE. But, on xilinx web, there is a ISE software. What is the difference between these two softwares? What software do I need?
Dear ALL, Here, I have some concern to build a INBIS model for a MCP (multi chip package). If let say, I have a product C that stacking up A and B. Now, I want to build a IBIS model for this new product C that have A and B together. But I just have the IBIS model for A and B seperately. And I just (...)
Can you folks share your feeling on these three tools in package SI, on-chip element modeling, PCB SI? We just count performance as accuracy, speed.
Hello carlyou, I think AWR Analog Office helps you to solve your problem on Interconnect analysis using transmission line models... There are Five abstraction levels available to analyse an interconnect... 1. Lumped element 2. Distributed element 3. Transmission line 4. RLCK model 5. 3-D EM model Go through the (...)
How can i generate IBIS model ver 4.1 using hspice ? any document ? Need to generate IBIS model for our digital IC. I do not have IBIS models for the IO drivers used in the chip. I have spice model & CDL netlist for the IO drivers. I also have package parasitics (R,L,C) for each pin.
Hi guys, I was wondering if anyone could give me any suggestions on what I should do, at the moment I have a batch of PIC16C73A and these are one time programmable(OTP) micros and because they are OTP micros, I would not be able to develop programs using this chip without wasting them and I don't have a emulator. I was wondering if there is a w
Infineon doesn't provide ready-to-use spice models. They provide chip SPICE model and package model separately. You have to manually join the models together in a single model for the device. But the Ansoft designer already has the model ready to go and (...)
Hi all, I design a circuit operating at 10GHz and finished layout. Now I want to add the pad and consider the package. Does anyone know which package and pad (the size) I can use for 10GHz and where to get the model for the package and the pad. I am use 90nm technology. Also someone told me that for 10GHz, I cannot (...)
Hi, I am working on design of LC VCO for 2.4 GHz. it is integrated with on-chip LDO and Buffer. 1. I would use 8 Pin Leadlless package. I need package parasitic model may be with approximate Values. if you have any paper then please give me. I will be thankfull to you. 2. also I am seeking help on (...)
Hello, All, I am designing a 5 GHz PLL circuit using a CMOS process. This circuit has to be packaged for testing. I am wondering how to get the PLL 5 GHz clock signal out for measurement. Does it require special high speed I/O design? Thanks in advance for your assistance.
When you look into a chip, you have certain behavior. When you look into the device (that is the chip + package), the behavior may change. If you have a chip input with 0.5 pF input capacitance and the package adds 0.2 pF, the device has 0.7 pF input capacitance. So when specifying a device, one has to (...)
Thanks for your reply:) To simulate influence of BGA package on chip circuitry parameters i need some kind model of it. For example, it's influence on LNA. What i should do?
Is that the marking on the IC? If so, what is its function? What device is the chip in? Photos can sometimes help. Keith.
You are talking about a piece of wire, either bond wire or PCB trace. You rarely need to employ a "manufacturer" to implement it. Seeing the problem from the other side: You have plenty of unwanted inductance in most circuits. It's a more common problem to ignore the already existing inductances in a simulation by using a raw chip model without
Hello all I have downloaded the .zip file that contains several files for the simulaiom model of ddr3. I understand the files and have a shallow idea how to proceed further. Only thing that I am concern about now is that there are 3 models. ddr3.v -ddr3 model ddr3_mcp.v -structural wrapper for ddr3
Hello all, I'm currently working to create a spice simulation part for a OP-270 dual opamp chip. I'd like the model to include both opamps in the chip, U1A and U1B so that i can properly number my schematic, but still simulate it. As a test, I created a part based on the basic pspice OP27 part and added the simulation (...)
I have mod*els*im 5.5 SE and PE but this not have chip xi*li*nx.... Can you help me... Tnx... I know a version XE but it's ippossible fint it...
I pulled this chip from a board and I'm almost certain it is a microcontroller. It is a 40 pin dip package with the following information on it a large S (for Signetics) APC932GEN 3560001RT 2342009 9418KA -1 Intel 1980 Signetics I've been scouring the net and even intel's website without finding any information on this (...)
You can look for some chip vendor's IBIS model . It include the package inductance and resistance . For IBIS info , you can take a look at
I want to design a baseband chip on telecommunication, which seems rather diffcult to describe with HDL directly. What tools should I choose for algorithm simulation and verification?
Hi, Can anybody provide me the model of 0603 & 0402 packages for resistor, capacitor and inductor. I mean ......... I need an euivalent ckt. of 0402 SMD chip resistor, inductor and capacitor. No matter it can be of any manufacturer. --X--
Hello. I've skimmed all of the posts and searched this forum and haven't found this topic covered. My question is: How do I create a port in the middle of a microstrip trace in Ansoft's PlanarEM? I'm designing a circuit using transistors in an SOT-343 package. The footprints in Ansoft's library have the ports of the transistors in the middle
Hello ramani, I think AWR SI Design Suite helps you to solve your problem on Interconnect analysis using transmission line models... There are Five abstraction levels available to analyse an interconnect... 1. Lumped element 2. Distributed element 3. Transmission line 4. RLCK model 5. 3-D EM model Go through the following (...)
Hi everyone We are just starting the SOC design project which includes large digital logics & PMU(DC-DC converter) & Audio CODEC (or D-Class AMP) We are concerned about noise/interference/EMI issues when all these block are integrated in single chip. (especially about grounding, shielding, de-coupling, etc) is there any materials(book
We used the micron SDRAM chip in our project a while ago. This might help. Also this is the data sheet for the part that we used. Good Luck.
Hello, I have a inverter type on-chip oscillator (as shown below) with standard 13.824MHz crystal, it give ~ 36 psec(rms) jitter. PLease advise how do I reduce this jitter. Target: ~a few psec, (possible???)
I think chip production test is a very good topic as test cost is a big part of whole chip. such as a 4x4mm chip, the test cost may be 1/3 of whole chip, while others is die and package.
I have some questions about BGA bond wire package. I am not sure whether it is the right place where i post this topic. 1, Some material says the path from chip pads to the ball of BGA consists of bond wire, trace, via and solderball. The question is that usually the length of trace is on mm level, which means above certain signal frequency the
I have some questions about BGA bond wire package. I am not sure whether it is the right place where i post this topic. 1, Some material says the path from chip pads to the ball of BGA consists of bond wire, trace, via and solderball. The question is that usually the length of trace is on mm level, which means above certain signal frequency the
Your chip has some equivalent capacitance and vdd and gnd leads inductance, which means LC circuit with natural freq ω0=1/√LC . Also you have some resistivity form vdda lines... which actually helps in damping. You can not change C, but you can try to decrease L, which means that ω0 will be shifted towards high freq... I dont know
I have designed a 12bits pipelined ADC. I already have the silicon with me and the behaviour is not as good as expected :( In fact, I cannot explain what it's doing at all. I am going to explain what I have, if anyone could give me any hint about what could be failing, I'll be very grateful. The only internally generated (bandgap) voltage that i
I want to know when we doing simulation ,how much is the output capacitance we should add to the analog output which we will connect to the outside of the chip and do some test? 10PF,20pf,or more? 3X!
Dear all: I've design a regulator with an off chip npn(mmbt3409) as pass element(common emitter), I put the dominant pole at collector of 3904(CL * Rout), With the download model on NXP, Spice simulation seems OK. But when I measure that chip, it rings. Did you have any experience like mine, measurement can't be predicted by (...)
Hi, Can any one help me in choosing Lg in a source degenerated LNA. Can I design complete Lg with the on chip spiral inductor? Or depending on the package I use, do I need to have the value of the inductance of the bond wire of the package? How do I simulate the bond wire inductance in cadence software?
The best thing to do is to subject the supply to glitches it is most likely to see in the real case. Add inductors from the package model..overestimate it a little bit. Add a switched current source in parallel drawing current from the supply (to model other blocks in the chip).
A rough calculation gives a SOT23 pin and leadframe resistance of about 0.5 mohm. The pin cross section equals a 1.5mm 35u (1 oz) PCB trace. The main resistance contribution can be expected from the bond wire and the chip itself. Zetex has SOT23 BJT with a 5A IC,cont spec., they are pretty suited for IGBT gate driver circuits.
I have a working spectre simulation using an nport to load the s-parameter file of the package and a layout extraction for the chip. I need to generate an hspice model, but the netlist fails. I get the following messages: Messages: ERROR: Missing or incorrect master.tag in library analogLib cell nport view hspiceS spice cmos_sch cmos.sch (...)
hii...i need to get a dc-dc boost converter chip that can step up min voltage of 3.3V to 18V..how to choose the best model? I have found one product that is max17075 but the manufacturer only have stock for TQFN model..i need a DIP model. thanks in advance..
the simulation results of BG is around 1.22 but the tapeout results is 1.3~1.4. The structure is common, but L=2u for current mirror and W=2u L=30u for Res. Can any body give me some suggestion for the huge deviation between simulation and Post ad
There are devices that are produced in different packages with different pin count so a model is not enough, that's why there is also a package setting. There are also speed grades that can work faster than others, this is printed in the chip case and is explained in the datasheet. The synthesis too can be the XST which is (...)
What about CEL NEC NExxxx in plastic package and ATFxxxx? It looks that for NEC's S parameters given from chip center, not from leads. I examined parallel feedback oscillator with microstrip resonator, and it seems that feedback microstrip loop lenght = exactly inverse of S21 angle (more or less 1deg) at frequency of oscillation So if S21 angle