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460 Threads found on edaboard.com: Copper Pcb
Hi all... I have a issue regarding tin plating on pcb's. I am making pcb boards since long for my personal use but the copper on the pcb gets oxidized very quickly, so i am planing to tin plate the pcb. i have even tried electrolyte tin plating on pcb's but the traces peels out when the (...)
I have done these devices with the pads 1:1. Even though they show the pads smaller when these devices are put on a board they are connected with maximum copper for heat sinking purposes so with the recommended solder mask opening you effectively get a 1 ;1 pad. So I use IPC-7351 standard and use a 1:1 pad with a 1:1 solder mask opening and get the
^- This indeed could be at least part of the problem, especially if you had some composite parts (such as separate inverter gates represented in the schematic) for a single HC04. Another issue could be related to copper pours/polygons that may have been assigned to a net and used to connect pins on the net, instead of distinct traces. Alot was cha
There are many GND Vias between RF traces, but In the middle of the GND plane, some vias each have a black square(copper removed) next to it. 135956 What's the reason behind this design? We are considering follow the EVB's design in our project. Any help will be greatly appreciated!
There are many GND Vias between RF traces, but In the middle of the GND plane, some vias each have a black square(copper removed) next to it. 135955 What's the reason behind this design? We are considering follow the EVB's design in our project. Any help will be greatly appreciated!
Hy I am designing a power distribution board using the OR-ring topology. The board has to carry about 34A per contact ( and 140A in the common nets. In order to route the power nets I have used a copper pour area in all the 4 layers. I plan to use 70um copper for both external and internal layers. I have checked Saturn pcb (...)
Hi I would like to know which thickness I should apply when they don't mention it inside an article. I want to design an antenna of some ieee article . They said that the substrate top side is a copper coating also acts as the ground plane for the open microstrip line (feed) which is etched on the opposite side of the substrate but hey didn't m
As FvM already stated, the easiest way to do is using blind via's from layer 1 to layer 2. An other option is using a double core construction. Instead of using one core and two copper foils you can also build a 4 layer board with a double core construction. Contact your pcb manufacturer. They know it all.
134515 I think you are not creating the PDF correctly. Use following method: 1) Click File > Print 2) Select PDF as shown in the attached image 3) Select the desired layer. You will have to create one PDF for top copper layer and one for bottom copper layer, seperately. Say, you only want TOP layer fir
Hi, Did you try to find the information on your own? (I doubt it.) Where? At the place where it is produced: the pcb manufacturer. A simple search "pcb copper thickness" gives many, many, many results. Often you find: 1oz Cu per square foot, 1.0oz. = .0014″ (35 microns) , 35um, 0.035mm Other thickness for sure
Thermal pcb design is always an interesting problem. These days there are many solutions dependant on the circuit complexity and how many layers required to get the routes in. I recently did a 12 layer (all 2 ounce) flexi-rigid layout with numerous D pack and similar devices, lots of copper pours and thermal vias. The best use for metal clad is sim
what is the aproximate area of pcb copper required to dissipate the heat?
All the component calculations, at least up to very high frequencies are identical. When the frequency is very high, the calculation stays the same but the effects of wire leg inductance and package capacitance may have to be taken into consideration. Heat sinking with SMD devices is normally achieved by soldering the tab to a copper area large e
Here have some measures, please check whether are right? If have better measures, please advise. 1. Exposed copper: There is no timely processing out of oil area; 2. Not balanced IC Sn surface: Don?t carefully checked IC area after Hot Air Leveling; 3. Repair: Worker single-handedly take-off and release board to make boards overlap each other
We are a professional pcb manufacturer( ) in China and certified by ISO and UL approved.We focus on : 1 . 1-30 layers for rigid pcb fabrication 2. 1-10 layers flexible-rigid pcb. 3. Metal core board, Heavy copper board ,HDI board . 4. quick turn pcb service: finish 2 Layers in 24hours, 4-8Layers in (...)
I prefer to generate a separate "outline" gerber file. Positive copper artwork layers shouldn't contain board contours, they need to be removed by a CAD operator manually.
Advanced pcb companies (including pool providers like Multi CB) have 200 ?m structure size for 2 oz copper which would still work with dual row 0.4mm BGA. But a brief look at the TI product selection shows that are also similar types in SOT23 etc.
The appended dxf is useless because it has all data in a single layer. pcb layout data must have separate layers for each copper layer (apparently 1 in your design) soldermask(s) silkscreen ("marking") board outline drills Drill data must be probably manually converted because a file with x/y coordinates and tool number is expected. (
Hello, I'm just routing a simple board with SigFox TD1207 module and antenna. pcb 2 layers, thickness=1.6mm, copper layer=0.018mm (top and bottom) I need to control impedance line for antenna, must be 50 Ohms, on the bottom layer GND Plane. I'm using Altium, specify a pcb Rule (impedance = 50Ohms), but it seems doesn't work, (...)
Hello, Just designed and manufactered my BlueNRG-based pcb on ******, see attached picture for a 2-layer pcb with a pcb antenna works at 2.4GHz. pcb specs: Length : 55 mm Width : 30 mm Quantity : 10 Layers : 2 layers Thickness : 1.6 mm Surface Finish : HASL with lead Finished copper : 1 oz Cu Solder (...)
A stackup drawing defines finished thickness and each layer of conductor and dielectric. Vendor can choose either doubled sided copper in a multilayer and how many layers of pre-preg to make up layer thickness, for example in a 4 layer board.
smoking epoxy is known to be carcinogenic with a soldering iron. (how much I dont know) copper melting point is far above the temperature of a soldering iron. FR4 is made from epoxy and fibreglass weave. If a trace gets hot enough below the copper melting point, the epoxy will smoke Therefore designing a fuse on FR4 is a bad i
The only pcb parameter that might be already critical in the low voltage range is horizontal copper-to-copper and particularly drill-to-drill and drill-to-copper spacing.
I have seen multicore CPU designs with 50 layer boards with daisy-chain water cooling. circa mid-80's on mainframes. ($$$) also with pcb fab and gold plating done inhouse at a Sperry plant we closed with 200K square ft in TriCity Tenn. USA. Too expensive. You can consider a 2oz multilayer track + pwr plane for low inductance and Vcc-Gnd high capa
Besure to have adequate exposed copper for acceptable, Rca. and the coil ambient is not room temp but that heatsink rise plus ambient. The datasheet is not at fault and appears to be well designed to achieve this with a large 2520 conductive internal case footprint to the small pads. Keep in mind the Rca with 1 sq in of double sided copper with
On the outer layers it is called "copper Thieving" or "Plating Balance". It is added to the outer layers of a pcb to create a uniform distribution of copper across the surface. This is done to make sure that the copper plating in the holes is uniform. If the copper distribution in the artwork is not (...)
We wish to heatsink our SMT inductor pads by thermal via?ing them down to bottom-of-pcb layer copper, and then using thermal transfer stickers (or some such thermal conductove transfer medium) to transfer the heat to an under-pcb heatsink. Therefore, we need SMT inductors with large pads. The inductor is 1uH and i(peak) = 20.5A and I(rms) = (...)
Just opening the pcb solder allow to reduce the calculated width of copper track required for that routing.
Hello For RF designs I have always specified a "solid" copper flood for ground and power planes, with sparing use of thermal reliefs if necessary (and avoided them for RF!). However, I note that a lot of consumer/professional pcbs have planes like this: 128551
Hydrogen peroxide is used as activator for hydrochloric acid, but hardly works alone as a copper etchant. See some previous threads about the topic:
Dear manuager, HDI & Multilayer pcb Over 15+ years specialized manufacturer in china. 1、Provided ?pcb pcbA One-stop shop?service. 2、Covering the 2-14 Multilayer pcb Prototype,HDI pcb,High Frequency pcb,Thick copper pcb, Flexible (...)
I don't see a copper feature that couldn't be drawn with regular trace segments of fixed width. Even if some traces have varying width, there's hardly a necessity to do so.
Can this be manufactured: 4 layer, 6 mil trace width, 7 mil spacing with 2oz copper ?
Hi all, I have some doubts regarding the Design For Manufacturing(DFM) I wonder why we need to maintain more spacing for shapes in pcb. For Ex trace(copper) to other elements we will maintain 0.2 mm gap and Shapes(copper) to other elements we will maintain 0.4 mm. Can anybody explain the reason for this?
The "sensor plates" are just a pcb structure which will be designed into your actual application board. NXP and other vendors have application notes describing how to. For a demonstration or test, you can cut it from a strip or copper cladded board. The interesting component is the capacitive sensor IC.
It can be pcb solid copper area 7X8mm, preferably on both sides, connected with 4-8 solid via (via filled with solder) Most likely your pcb will have 1 oz thickness of copper; you can increase the area in that case You cannot just replace 2oz with 1oz copper and increase the area, the heat spreading (...)
hi, Is your posted image of the pcb showing the copper track side of the pcb or the Component side?. E
I'm wondering if there is an easier way to do this: Situation: I have a circuit that is complete in both the schematic and pcb. I now want to clone this. If I do a copy and paste of the schematic the designators for the clone are all set to _1, so no problem select them and reset them and then assign new designators. I can also clone th
Datasheet pg 3 does say 23degc/watt for rthJA….but that it with an enormous amount of pcb copper and thermal via’ing, so if you cant replicate that, then there is no way a soic8 can do 3W.
Hi, could some of you folks here suggest me the models of printers that could be used (with some modifications) to print directly on a cleaned copper pcb? Personally I think this is the easiest way , since the transfer from a paper is more messy and I dont have that much luck with it , yet I want to try the printer version. thanks.
hi I am using orcade 9.1 for pcb designing. Pls can anyone tell me how to add teardrop in gerber file copper layer. in my software it not able to select copper layer. thank You.
HXP circuit is a manufacturer in China. We offer fellowing board, 1.Matel core/based pcb(Alu pcb and Cu substrate pcb) 2.Hybrid multilayer board(Rogers+FR-4) 3.Heavy copper pcb(Up to 6oz) 4.Flex-rigid, Rigid, Flex board 5.High Frequency Board(Rogers,Arlon,PTFE) If any (...)
Rigid-Flex pcb 3 layer 26.1*16.94 mm 0.4 mm rigid /0.1mm flex Polyimide + FR4 material 2.5/0.5/2.5 oz copper Hard gold plating 5u" Polyimide cover layer on bottom only No silkscreen Contact me
Hi everyone, I've been trying to get the copper layout of a previously designed pcb imported into Altium's pcb editor. I've been following the procedure found at: and have been able to import the files into Altium's CAMtastic CAM editor. I've set up the Layer
single layer copper based pcb Material: copper base. 40mm*60mm 1.2mm copper: 2oz Green solder mask, white legend. If you have the copper base proect, please contact me
Minimal required is top/bottom copper (3/9), mask (6/12), board outline (2) and drills(15). Silkscreen (6/14) if actually printed, paste (7/13) if the board manufacturer is also making solder stencils. Other files are for assembly and service purposes. But there's no problem to send the complete file set to the board manufacturer. The job deta
hi, I want to set 2 layer pcb substrate in Ads 2009. copper FR4 copper What are the proper steps? Vias setup is also required. To make ground plane and copper areas , i am using polygon which are not reflected back in schematic (layout to schematics). Is there any other way to do the same job?
For power devices, in general I do not use the available track width calculators, due this often yields a prohibitive result, and instead of this I just remove the solder mask to increase its capacity to deal with higher currents than the nominal for the varnished copper.
The thermal resistance rises significantly compared to copper clad alum, but it is possible. Compare per Watt. for 30'C jcn rise. and check/compare with


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