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15 Threads found on Metal Pitch
Adding to starinspace's message: You have to first check the routing, pitch(metal-M, M-V and V-Via). For any thing , first you have to design a Layout and then you will know the trade off to design.
Open standard cell LEF, Get the height of cell and divide it by metal 2 pitch.
Hi, All what is a metal pitch? I have to design a Full Adder with 12 metal pitch, what does this mean to layout? thanks, all!!!!
I've 2 macros in my design. One macro has 20 pins & another one has 15 pins. Now I need to calculate the space required between the macros considering the routing resources. How do you calculate the space? Let say metal routing pitch is .1u and 6 metal layer process.
Technology node (180nm, 130nm, 90nm, 65nm, 45nm, 32nm, 22nm, etc.) is defined as the lowest metal (metal 1) half-pitch (i.e. metal width or metal spacing) for the DRAM version of the process. Gate length or channel length is usually much smaller than the process node dimension (for example, in 90nm (...)
Normally we leave some space for power ring around the macro. You may need to calculate the required space through applying the Power metal pitch value. The required space should be able to accommodate the 2 power routing tracks.
Sorry to say, but that coil-over-bolt antenna :D from the movie, hard to believe is a Helix antenna. Helix antenna in normal-mode have a specifically spacing and pitch angle between turns (and no metal core inside). In my opinion from how was realized, was just lucky that radiates some power in the broadcast band.
Hi, I observed the Spacing and pitch of the metal lines values in the lef file .Whats the purpose of mentioning two ?Is any one is not sufficient to Place & Route tool?
What is meaning of pitch of metals: like 1x pitch metal, 2x pitch metal. Is it related to thickness of metal ??? Is high pitch metals provide more current than lower pitch one???
It is related to Encounter. This helps the place and route tool to place the cells in such a way that you don't get any DRC errors wrt to notch errors, metal to metal distance and metal area etc.. If this is not followed there is a good chance that there will be a lot of DRC errors and you would have to correct them manually.
metal pitch = metal Width + metal Space. Second part of your question I didn't understand.
LEF is technology dependent file. It defines the layer, the metal width, space, pitch and via size. All std cell in lef is designed by that design rule. So you can not immigrate the lef from .25 to .18. Even if the same process with different foundaries. But if you have technology design rule file. You can manually write the LEF file in technolog
ptich is the allowed minmum distance between two metals of the same layer, but it is not the same with metal spacing
Top metal should be used for probe window. And the size is about 10um*10um.
silicon ensemble uses rules described in "technology".lef. Simply look all LEFs which you read in. There is described e.g. the metal width, pitch, via rules. The rest has to be done in Silicon ensemble itself. So you need also a verilog netlist and the abstract blocks (LEF) for each primitive element used in your netlist. I do not think silicon e