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Hi everyone, i need to create this Die package.N-channel power MOSFET has Source ,Gate and Drain pad need to create but in this datasheet ,i have pad size for Gate (widht not mention for Gate) and Source,but Drain mention as Back How to create this Die package. Package
Use a pad attenuator at the mixer LO port (which most of the RF mixers use) and this will solve all the impedance matching issues at that port.
Hi everyone, To have a symmetrical supply power of my design, I have put the VDDA to +1.65 (techno AMC c35 3.3V) and VSSA to -1.65V. And I have several blocs that have one node to GND=0V (for example the positive input of the integrator amp-op). As I have finished the circuit layout, I want to add I/O pads to finalize my circuit. I have differen
Hi I am looking for a rework station for soldering and desoldering of IC with power pad. That is IC with metal landing at the bottom for soldering onto the plane of the pcb for better heat conduction. Thanks Alan
That isn't a large current or large power and nothing you mention is likely to impact package size at all - seems like everything you mention could fit under just one bond pad. Now, if this is for a classic "4-20mA" interface, are you sure 1.8V of headroom suffices? Do you have a common mode voltage or ground-offset spec to meet?
I think multi-band. Because of mobile phones (2sim gsm+cdma+gps+bluetooth). maybe. But more recent papers focus on beam steering, something like wifi wich alters beam direction to point in your phone/notebok/pad. To reduce interference, focus power, increase speed.
also sounds like you may have a noise issue , with high di/dt current pulses going through your control ground. The source sense res ground pad needs to be your control connect that to the chip ground so they are one and the sane at all times....don't let power switching current run through lengths of control ground. You may also nee
I use multiple external hard drives with my current laptop (3TB (3.5" USB External), 2TB(3.5" eSATA External), 1TB (2.5" 9.5mm tall USB Hub Cooling pad), and 1TB (2.5" 12.5mm tall USB HDD Shell). the 1TB (was unpowered) in the shell fell out of my hand while shifting my laptop, cooling pad, external hdd, and power cord (...)
Hi, I have an idea here to power a PC fan cooling pad that runs on USB(5V). The power source is from an AC powered smartphone usb charger as shown here. My thinking is this will WORK if the data cables on the the pc fan cooling pad is
Limiting the current, but also ensuring that it spreads evenly so as to avoid hot-spotting and local power density related physical damage. Pullbacks (with salicide block) are the norm in ESD protection device design. They should be used on all pad-connected drains / sources. PMOS may not be self-survivable (i.e. its own D-S breakdown is low en
you are assuming that the buffer amp does not reflect any power, when in fact if reflects power and can even send spurious signals out of the input port. Put a 3 dB pad between the two and the effect will be much reduced.
Hi Sunny, Yes, R-creates the Joule heating. I have 0.44ohm on vss to clamp and 0.5 on vdd to clamp on Z layer. So, total 0.94 ohm from vdd to vss pad which I guess satisfies ESD rule (<1ohm). 1) Does this 800um (pad to pad) current path can tolerate with esd current? 2) Can we connect Bump pad sitting on IP to Internal Powe
Because 10dB pad will have a return loss of 20dB adding one helps to ensure that the impedance seen by the DUT is close to 50 ohms resistive. 73 Dan.
What - exactly - is your problem? More info from your side is necessary: Got the pad frame? With existent power supply pads/rings and I/O pads? Are there other cells besides your LNA (to be) connected? Can you show a picture of your cell and the pad frame?
Designing a 4-layer board (signal+pwr, gnd, signal+pwr, gnd), and I have some newbie doubts about the best option to connect different connector's pin or IC's pad to power lines, or sometimes to different signals. Board has different parts: power, MCU & RF. The main issues I have: power at connectors. Which is the design g
Hi all, I've a problem with Altium 15 at the end of PCB routing: Once routing was done, a "from-tos" line (one ratsnest) remain on the screen. It link an object connected with VDD (smd pad, or also a with a via through power plane (VDD)) with something that resides off-screen. No way to see what kind of object is because the line go away from
The two lines that form a V are relief copper connecting the pad to the power plane.... You have your pad relief set to 45 degrees. Two points components are soldered... Very little tin/lead solder is used these days, RE. RoHS 2006. how come when I probe them they are Not listed as Clines or Cline Seg?
Hi I have a tpr file that it is a description of ALU.I want to make layout for it with cub library(cub.tdb file) in Tanner L-edit,but when I try to do this with SPR, it makes following error: SPR pad Route setup: pad route i/o signal layer and power layer must be different. please correct spr pad route setup> layers. (...)
square, you have more space in the core area if you have pad on four sides.
Have you something called "route offset" (or similar) in the settings? If not then add some copper to the pad so that the route comes into that, stopping before the pad perhaps?
You won't remove copper in this stackup. The RF structures have to be designed respectively, e.g. you have only CPW with ground. If pad capacitance becomes a problem, it's the wrong stackup for your design.
Hello! Here is my implementation (in pseudo code). For a 4x4 pad, you need 4 outputs and 4 inputs. You power the output and you check if any input is high. In my case, I power the column and I check which line is high. Let's say that you use portA lower bits in output and higher bits in input. int8 column = 0; int8 keyindex;
If you know the load, the pin will see in your application, for sure add this constraints. Certain interface protocoles request some max transitions, timing relation from a pad to another pads... For the strenght choice, the power budget, interface speed, could involve, in functional or test mode, for example, the load on a tester machine (...)
It seems you want to connect the power net VDD&VSS to a pad to the internal ring, and the pin on the pad VDD/VSS are not with the correct CLASS. You need to check the LEF first.
Hello, We are dissipating 2 Watts in this CSM3637 surface mount resistor, any tips on how we can heatsink it? CSM3637 series power resistors... We thought of bringing loads of thermal vias through each pad to the bottom of the PCB to pads there, and then sticking a thin insulating pad over th
spudboy488, thanks for the reply! Although I can get pads in layers other than drill to be setup as oblong, drill won't allow it, at least in Orcad 9.2. I believe I'll have to talk this with the pcb house. And if I needed a final pull to upgrade, here it is!!! ;)
if you have only one "source" (pad) for the current, the resistance to the "farest" cell is more important than if you have multiples pads around the chip. Or the length between the power pad and all elements which need power is reduce, then the resistance is reduce and then U=R* I is reduce, which means (...)
Dear analog experts, can someone comment on typical IO pad speed at low voltage (0.9 voltage), c90lp technology, and low-power IO let's say? What would be a decent output delay I should expect, in worst case, 60 degree C, with 0.9v or 2.6v IO supply? 0.9v -> 50ns, 2.6v -> 10ns?
Hi, I have a question of floorplan. In top chip layout when we define a core and its dimension in the command "floorplan", does it mean all the cells (IPs, standard cells, analog instances...) should be placed inside? There is only something like power rings, pad rings, wire connections outside the core? My design is mainly digital, but with
Hi everyone, could you please give me some advice on pad placement, especially for power/ground pads? I know some basic rules like 1. place the pads close to their corresponding pins to simplify routing 2. place VDD or VSS around special pads like refclock, reset for noise shielding what else?
Is it better to place vdd over gnd? f.e. m3 is gnd, m4 (top) is vdd. In pad rings the power lines usually are on same metal level (because the space beneath is used by I/O and ESD protection circuitry). But there's no reason why not to put them over each other, with the additional (desirabl
I have for many years used telephone wire (solid core, do not know gauge) for wiring up circuits on pad-per-hole vectorboard. If I find scrap wire during facilities work I grab it. If it's amps then I'll go to stranded heavier gauge like I get from harvesting electronics (PCs are full of nice fat power wires). Telephone wire lives at 48V so the i
I am using pad power with standard dimension as input signal. A power pad always includes a strong ESD protection, so you should calculate with the a.m. figures. 130nm pad libs state a max. pad input capacitance of 10pF - even for pure input pads (with ESD protection). (...)
The power routing should be done during the floorplan step, with adding, addstripe or edit route (shift + a) and this a manual step. Only the standard cell, could be route with sroute, properly, for macros and pad, it is better to use the command indicate before. Other command could be used to route the second power net for multi (...)
intermittent failures could easily be either microwave load oscillations, or low frequency bias line oscillations. have you tried a varying load to try to induce failure--like a 3 dB pad in front of a sliding short? You might have trouble seeing it, the oscillation can start up ~ randomly, and blow up the device before you could see it. Use spec
I am using SIM908 GPS_ANT pad to connection to an SMB connector from where it is connected to external(passive) GPS antenna. But SIM908 is unable to track even a single satellite. I have used other GPS modules and signal loss due to impedance mismatch can cause degradation of signal resulting in less satellites being tracked. But in this case not a
... is there any reason why the pad cannot be connected to on M2 and M3? Is it for the ESD protection circuitry? No, I don't think so. Anyway, you always have to go to top metal latest at the pad itself. For power bus connection, M1 routing to the pad doesn't matter because of the larger capacity to GND (which is e
Corner cells - For pad ring connectivity, it contains only Metal layers. no active layers. these special cells contains metal structures that are bent 45 degrees, to maintain continuity of IO power buss structures.
The power pad ring should be made by the pad and the filler pad inside the row pad and also corner elements. Normally no special route should be added by the designer.
There are different MSOP packages in the Altium designer PCB libraries. The first point is to check if 0.45 pad width is appropriate for the respective part. It might be for some power devices that have relative wide pins. Secondly, the solder mask finish depends an actual expansion rules. Now it's apparently about 0.1 mm, which mostly isn't
Some prototyping PCBs have these sorts of common strips / rings. Myself, I prefer buying large sheets of the pad-per-hole Vector board, cutting it into many little pieces (I tend to do small assemblies more than large, but I have done complex digital boards of maybe 20 ICs plus passives). I build up the power and ground bussing as I go with wir
you also measure the current going through the power supply dedicated to digital instead common ground, no? By this way aou are sure to not include pad leakge for example or analog...
Hi, geniuses. I wanna ask something about power extraction using starXtract, Calibre Xrc or any others. I'm looking for a simple way to analize power net resistance on chip. Let's say that I'm designing a long-thin chip, and I want to know the resistance of power net on edges from the power pad. (...)
Wilkinson as a passive device do not introduce noise in the circuit, but it's insertion loss (about 3dB) will affect the system noise figure. So, in the simulator don't need to add a noise source, but just a simple 3dB pad attenuator.
Are you using common via for both signal and power. Any way open your via in pad Designer and check if thermal relief is defiened for inner layers if it is so you can make it "null". then you will have completely filled via for all copper pours.
I think yes because as we add an io/core power pad, we have to also add an io/core ground pad.
Not sure what cheap is, but there are plenty of them by 3M and Fischer, if you search for "thermal adhesive pad" at Farnell. I've used ones from Farnell to stick high-power LEDs directly onto a small BGA style heatsink in the past, (but I only ran a single LED per heatsink at 350mA). Maybe better to bolt a large heatsink onto the PCB?
1. Digital pads have digital buffers (inverters) to interface the off-chip electronics with the core. No analog signals can thus pass through a digital buffer 2. power supply pads have ESD protection circuitry and must allow the flow of large currents. They are usually bigger in size 3. Usually the I/O library provided with your technology (...)
Hi all, When I trying to do Special route for pad pins after the power ring has done, the terminal shows following err msg: Reading LEF technology information... *ERROR* "data_files/macro/dp_rf_256x8/dp_rf_256x8.vclef", line 374: cannot add PIN QA to MACRO dp_rf_256x8 at or near "QA" *ERROR* "data_files/macro/dp_rf_256x8/dp_rf_2
It appears that your power button is a momentary button (you push the soft button on the panel and a material under the rubber button contacts the ring-shaped pad directly below it). About the only way to see if it'll be easy to do is to see what happens when the power button is depressed permanently. Try this: Remove the battery, find (...)