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I have pcb see picture. NetC73_2 and NetC88_2 is high power sinus Vpp 50V 10MHz NetC89_1 and NetC38_1 is feedpack for driving amplifier with signal level hundred times smaller 500mV 10MHz sinus too, but not necessarily synchronous with high power. My question is How much interference arises on the yellow line between them? NetC38_1 is 0,
Hi All, few elementary questions : I am designing a multi layer pcb in Altium using the general 6 layer stackup format as shownn below : 133757 1. Can we connect one of the internal signal layer pcb track (or internal plane) to a though-hole component pin (let's a pin of a 2.54 mm pitch pin header) without using via
I am doing single rank ddr3 routing in a 6 layer board with the following stackup:- Signal(L1) -> Gnd(L2) -> Signal(L3) -> Pwr(L4) -> Gnd(L5) -> Sig(L6) (I am using Saturn pcb Toolkit for calculations) Via 1 (L1-3) Via 2(L1-6) Height of Via 12 mil[/td
[hello, please let me know below answers. 1. laminating (build up & layer build). what are these method.? 2. L/S mean..? than you in advance.
I am designing the pcb for BGAs at double side. 127739 I think that it will need to use HDI pcb. It is first time to do HDI pcb design. It is difficult to decide the layers and stackup. I am considering about the following spec. - 3 + N + 3 type stackup, 10 ~
Presume you are asking about industry standard 1.55 mm 4-layer pcb stackup. Most manufacturers have a standard stackup for pool manufacturing of prototypes, typical 700 ?m up to 1000 ?m core and 200 ?m to 380 ?m prepreg combination for the outer dielectric, mostly in the 350 - 380 ?m range. If you design your transmission lines for the (...)
Hello, Is there some technique, allowing to simulate Flex-Rigid pcb in HyperLynx. The consists in the following Flex-Rigid feature: it contains more than 1 stackup. Any ideas ? Thanks in advavce. Pavel
stack up can be changes ad per your pcb planning . TOP /GND/ PWR/ BOTTOM sounds good for your case
I'm skipping the question if your stackup definition is reasonable and if blind vias can be produced with the intended substrate and prepreg dimensions. Your pcb has a via through all layers, it can of course connect layer 2 to 16.
This is a low speed design that will require blind and buried vias. I don't believe that anyone will use blind and burried vias in a 4-layer pcb after considering costs and possible alternatives. Before claiming a specific implementation you should specify your design requirements. A pcb stackup will be designed from available su
The stackup definition is intended for your documentation purpose and normally not passed on to the pcb manufacturer. Eagle in particular doesn't support CAM formats like ODB++ that can optionally contain stackup information. Most standard pcb boards are made with 35 ?m (1 oz) copper. If you are ordering simple boards (...)
Hello, Is it possible to create layout directly in Allegro pcb tool (without having a deal with schematic): create list of nets create geometry objects associate these objects with nets create stackup associate particular net with a stackup layer Thanks in advance Pavel
We could be referencing 2 types of clearance here, high voltage and basic clearances for normal routing signal lines etc. Here copper weight plays a part, when you etch a board you etch inwards as well as down so manufacturers apply etch compensation to your artworks: So the thicker the copper, the more etch compensation added
And what if its analogue and digital.... Both analogue and digital signals travel the same way across a pcb (there are differences in return paths related to frequency) but digital signals are effectively analogue signals at this level. Without knowing the full design specification, board area, how it roughly places, types of signals, speed of sign
pcb impedance calculators have been often mentioned at edaboard, e.g. in this thread pcb substrates and prepregs thickness must be chosen from available products, there aren't so much options for a 16 layer stackup. pcbs are build sequentially around "cores". During this sequence, partial interconne
According to the small board size, a thinner pcb stackup like 1 mm has the advantage of allowing smaller via drills. Check the available technology of your pcb manufacturer.
Hello, On a RF pcb (operation freq. : 6-8 GHz)with the stack up details as below, is there any precaution to be taken while routing RF CPWG vis-a-vis a 2 layer RF pcb, especially w.r.t. Cu that is present below all the RF traces in the layers below the top layer (particularly input and output traces of both active and passive MMICs) Stack up:
Hello, I am using Expedition pcb to lay out a board containing differential traces. I would like to check its estimate of the impedance, based on layer stackup and trace width, but cannot find out how. I am pretty sure Expedition's 'Final Solver' calculates this, as the help files mention the equation it uses when discussing the Layer (...)
You need to ask your pcb manufacturer.
Hi all, As far i know, balanced pcb stackup follows 1. signal layer should have adjacent power/ground layers 2. from center of the board(cross-sectional) top and bottom should have same amount or weight of copper and the di-electrics. If i am deviated from the correct concept please guide me ***In my case, we are going for the 2 dif
Hi, i wanted to ask how are the standard difference signal lines rules when drawing differential lines in pcb layout? (please help, i need this as soon as it can be)
Hai, I am designing pcb with SIM900A GSM module. By requirement, the antenna pad of the module must be connected to the (SMA) antenna connector using 50 ohm impedence trace. The trace length is 784mils and is designed for 50 ohms as per the stack up of the fabricator. But now for cost reasons, we are wondering if we have to go for a imepe
Usual pcb tools are operating with electrical netlists and mechanical information (footprints, pcb layer stackup, trace routing). They don't care for impedances, substrate permittivity, signal frequencies and such. A pcb tool might provide an interface to a SI(signal integrity) tool or an EM simulator.
When i rout pcb at first i place big elements and make trial rout for understanding how to do this board and problems that can rise. After several trial variants i place resistors, capacitors and other small elements and make full rout to the end.
Hello I will be routing a board for the Freescale i.MX6 processor which is a 21x21mm 625 BGA .8mm pitch, DDR3 RAM etc. I am hoping someone here has done something similar and can maybe help me with a few suggestions regarding how many layers this requires and what a suitable layer layer stackup. I have so far only don
Hi Michael, I would suggest you to read following topics on pcb Stack Design: In pcb design you use even numbers of pcb layers. Although you can use separate layer for every voltage and ground but this approach will increase cost of the pcb manufacturing. These days embedded processo
I would need advice in deciding what pcb stackup to use for my project. I have two voltages (5V and 3.3V) and some LVDS (differential signals). Is this a good stackup? Layer 1: Components, small routing near ICs. I have also some signals that need to be 100 ohm (differential impedance). These I would like to route on the top layer (...)
You do not choose where the prepegs are. It is the PC B manufacturers production methode which determines where the prepeg layers are in your stackup. Most pcb manufacturers will use copper foil for the outer layers. With this method you need a prepeg layer to 'glue' the copper foil to a core. You need a prepeg layer between two cores. Have a l
I have a trivial question about board stackups between 4 layers and 2 layers pcb's All of my training documents use 4 layer boards. Using layer 1: top, layer 2: ground, layer 3: power, layer 4: bottom. I have a few questions about the board stackup. 1) The top layer is a signal layer? 2) The bottom layer is a signal layer? 3) In (...)
Hi all, Engineers who are familiar with HyperLynx please help solve stackup problem in HyperLynx. I'm getting stackup problems message when trying to simulate a one single net in my pcb. My pcb board has 2 physically layer only. But when trying to simulate a got warning message "The stackup has error". And (...)
Hi everyone, I was wondering which tool is best for model pcb stack up and able to do simulation on the model. We are talking about multiple layer. I would like to be able to change the dielectric constant and dissipate factor for core a on each layer. An example of layout is: Plane Gnd Core Signal Cu pre-preg plane Gnd I want to f
Is it essential having your engineers know about the cost first then to run the designs? They should know about costs. Firstly they need to know the specification and product requirements. If you know the requirements, a pcb manufacturer can suggest a suitable pcb stackup. E.g. 5 mil pcb structure size is moderate industry
Hi all, I have a pcb design for the Spartan-3E FG320 BGA in attach file. 1, Can you see schematic and send to me your remark ? 2, I will design pcb 4 layer. - stackup : + TOP (Signal1) ---------------------- 9 mil ------------------------------------------------------ [
Hi all, In what cases I need to make an antipad by myself? As I understood, it appears automatically on unrelated layers of pcb stackup. Am I right? Veronika
try tool from saturn Saturn pcb Design - pcb Design Service | Electronic Engineering it wont give you fulll layer stackup analysis but help you to calculate impedance,spacing etc.
Guys, need help. Can someone please share the high level FLOW CHART (process flow) of how to do pcb layout using Cadence Allegro. Familiarizing the UI is not a problem. I just need to know how to do it by understanding the flow chart so that I can compare how it differs from the previous pcb layout software I had used. I have been using Alti
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Hi, im using a roger material RO4350B for pcb design.Can someone tell me how to properly specify the pcb material in ADS 2009. Thanks
Refer this thread : Core vs Foil construction - pcbstandards forums
A start:
Zuzu The first thing you need to do is to determine how many signal layers you need. Then find out how many Power/Ground layers you need for your Power distribution and impedance layers. Also find out what core and prepeg thicknesses your pcb fabricator has in stock. ( using non-stock materials will increase the price and delivery time) Also fi
hi can any one explain me how to set up the stackup details for doing 4layer pcb in pads2005
I am looking at the fabrication artwork for a reference design. It is a four layer, 1mm thick pcb with 0.4mm pitch BGAs. They use blind vias and VIP for connections from Layer 1 to Layer 2, with 0.1mm silver filled holes. But the stackup calls for core and foil construction, with an FR4 core, 1080 Pre-preg dielectrics and copper foil outer layers.
I would expect serious warping due to the asymmetrical stackup. If lamination of FR4 and 4003C works at all, it should use a symmetrical layer sequence. What's your pcb manufacturer's opinion about the design? Possibly you should also contact Rogers. I have experienced, that a major pcb manufacturer made a Rogers/FR4 hybrid design (a (...)
I'm making a board with a Spartan-6 and DDR2 RAM. The 256 ball BGA escape can be done with only 4 layers, but the price difference between 4 and 6 layers from pcbcart isn't that high. I saw this six-layer stackup: Milkymist One RC2 pcb Specification - Qi Should I use thi
as the impedance of the traces depends on the used material and the thicknesses of the core and prepeg layers you should contact your pcb manufacturer first. Ask them about the thicknesses they have in stock and build a stackup with these thicknesses. If you are not comfortable with doing impedance calculations you can always ask your pcb (...)
How to set the board stackup thickness and layer in allegro pcb editor. Regards, vignesh.G
I added all the layer's thickness together and found it is less than 0.06 inch Yes, thats's reasonable, it's a pretty standard pcb stackup. What's your question with it? For tolerances, the manufaturer will refer to IPC standards. You can expect a tolerance of about 10% for finished thickness. If you need higher accuracy, e.g.
Ricky, Imagine a via that has all anular rings intact through an 8 layer stackup. What you would end up with is 8 metal plates that will most certainly act as capacitors. In high speed design this is highly undesirable. Usually what is done to negate this is to remove unconnected pads on internal layers either in the pcb layout tool or in fabri
Hi Bert, Every layouter has exact to calculate the cooper with for hes pcb, but in accordance of the pcb producer to know what kind of cores & so stuckups are possible for you. Than, if you can have i.e. 0.25mm core, you will calculate a cooper width of some tenth of mm for 100Ohm/ca.2x of that for 50ohm, & with these width have you to route all