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68 Threads found on edaboard.com: Pcb Stackup
This is a low speed design that will require blind and buried vias. I don't believe that anyone will use blind and burried vias in a 4-layer pcb after considering costs and possible alternatives. Before claiming a specific implementation you should specify your design requirements. A pcb stackup will be designed from available su
The stackup definition is intended for your documentation purpose and normally not passed on to the pcb manufacturer. Eagle in particular doesn't support CAM formats like ODB++ that can optionally contain stackup information. Most standard pcb boards are made with 35 ?m (1 oz) copper. If you are ordering simple boards (...)
Hello, Is it possible to create layout directly in Allegro pcb tool (without having a deal with schematic): create list of nets create geometry objects associate these objects with nets create stackup associate particular net with a stackup layer Thanks in advance Pavel
We could be referencing 2 types of clearance here, high voltage and basic clearances for normal routing signal lines etc. Here copper weight plays a part, when you etch a board you etch inwards as well as down so manufacturers apply etch compensation to your artworks: So the thicker the copper, the more etch compensation added
And what if its analogue and digital.... Both analogue and digital signals travel the same way across a pcb (there are differences in return paths related to frequency) but digital signals are effectively analogue signals at this level. Without knowing the full design specification, board area, how it roughly places, types of signals, speed of sign
pcb impedance calculators have been often mentioned at edaboard, e.g. in this thread pcb substrates and prepregs thickness must be chosen from available products, there aren't so much options for a 16 layer stackup. pcbs are build sequentially around "cores". During this sequence, partial interconne
According to the small board size, a thinner pcb stackup like 1 mm has the advantage of allowing smaller via drills. Check the available technology of your pcb manufacturer.
Hello, On a RF pcb (operation freq. : 6-8 GHz)with the stack up details as below, is there any precaution to be taken while routing RF CPWG vis-a-vis a 2 layer RF pcb, especially w.r.t. Cu that is present below all the RF traces in the layers below the top layer (particularly input and output traces of both active and passive MMICs) Stack up:
Hello, I am using Expedition pcb to lay out a board containing differential traces. I would like to check its estimate of the impedance, based on layer stackup and trace width, but cannot find out how. I am pretty sure Expedition's 'Final Solver' calculates this, as the help files mention the equation it uses when discussing the Layer (...)
You need to ask your pcb manufacturer.
Hi all, As far i know, balanced pcb stackup follows 1. signal layer should have adjacent power/ground layers 2. from center of the board(cross-sectional) top and bottom should have same amount or weight of copper and the di-electrics. If i am deviated from the correct concept please guide me ***In my case, we are going for the 2 dif
Provide number of layers, pcb material (FR4) I presume, layers you are going to route d-+ on (inners or outers).
Hai, I am designing pcb with SIM900A GSM module. By requirement, the antenna pad of the module must be connected to the (SMA) antenna connector using 50 ohm impedence trace. The trace length is 784mils and is designed for 50 ohms as per the stack up of the fabricator. But now for cost reasons, we are wondering if we have to go for a imepe
Usual pcb tools are operating with electrical netlists and mechanical information (footprints, pcb layer stackup, trace routing). They don't care for impedances, substrate permittivity, signal frequencies and such. A pcb tool might provide an interface to a SI(signal integrity) tool or an EM simulator.
When i rout pcb at first i place big elements and make trial rout for understanding how to do this board and problems that can rise. After several trial variants i place resistors, capacitors and other small elements and make full rout to the end.
Hello I will be routing a board for the Freescale i.MX6 processor which is a 21x21mm 625 BGA .8mm pitch, DDR3 RAM etc. I am hoping someone here has done something similar and can maybe help me with a few suggestions regarding how many layers this requires and what a suitable layer layer stackup. I have so far only don
Hi Michael, I would suggest you to read following topics on pcb Stack Design: In pcb design you use even numbers of pcb layers. Although you can use separate layer for every voltage and ground but this approach will increase cost of the pcb manufacturing. These days embedded
I would need advice in deciding what pcb stackup to use for my project. I have two voltages (5V and 3.3V) and some LVDS (differential signals). Is this a good stackup? Layer 1: Components, small routing near ICs. I have also some signals that need to be 100 ohm (differential impedance). These I would like to route on the top layer (...)
How do I choose which layers will be core or prepreg in my pcb stackup? I'm going to use 6 copper layers.
I have a trivial question about board stackups between 4 layers and 2 layers pcb's All of my training documents use 4 layer boards. Using layer 1: top, layer 2: ground, layer 3: power, layer 4: bottom. I have a few questions about the board stackup. 1) The top layer is a signal layer? 2) The bottom layer is a signal layer? 3) In (...)
Hi all, Engineers who are familiar with HyperLynx please help solve stackup problem in HyperLynx. I'm getting stackup problems message when trying to simulate a one single net in my pcb. My pcb board has 2 physically layer only. But when trying to simulate a got warning message "The stackup has error". And (...)
Hi everyone, I was wondering which tool is best for model pcb stack up and able to do simulation on the model. We are talking about multiple layer. I would like to be able to change the dielectric constant and dissipate factor for core a on each layer. An example of layout is: Plane Gnd Core Signal Cu pre-preg plane Gnd I want to f
Is it essential having your engineers know about the cost first then to run the designs? They should know about costs. Firstly they need to know the specification and product requirements. If you know the requirements, a pcb manufacturer can suggest a suitable pcb stackup. E.g. 5 mil pcb structure size is moderate industry
Hi all, I have a pcb design for the Spartan-3E FG320 BGA in attach file. 1, Can you see schematic and send to me your remark ? 2, I will design pcb 4 layer. - stackup : + TOP (Signal1) ---------------------- 9 mil ------------------------------------------------------ [
Hi all, In what cases I need to make an antipad by myself? As I understood, it appears automatically on unrelated layers of pcb stackup. Am I right? Veronika
try tool from saturn Saturn pcb Design - pcb Design Service | Electronic Engineering it wont give you fulll layer stackup analysis but help you to calculate impedance,spacing etc.
Guys, need help. Can someone please share the high level FLOW CHART (process flow) of how to do pcb layout using Cadence Allegro. Familiarizing the UI is not a problem. I just need to know how to do it by understanding the flow chart so that I can compare how it differs from the previous pcb layout software I had used. I have been using Alti
How to design a pcb stackup?
Hi, im using a roger material RO4350B for pcb design.Can someone tell me how to properly specify the pcb material in ADS 2009. Thanks
Refer this thread : Core vs Foil construction - pcbstandards forums
A start:
Hello friends, I've designed a lot of pcbs over years, including some simple multilayer (4-6 layers), but never faced problems to dig deep into stacking fabric (let manufacturer handle). But now we have to make a pcb with some diff. sensitive traces @100...200Mbps, so we need to calculate impedances involved. I'll summarize the questions for kin
hi can any one explain me how to set up the stackup details for doing 4layer pcb in pads2005
I am looking at the fabrication artwork for a reference design. It is a four layer, 1mm thick pcb with 0.4mm pitch BGAs. They use blind vias and VIP for connections from Layer 1 to Layer 2, with 0.1mm silver filled holes. But the stackup calls for core and foil construction, with an FR4 core, 1080 Pre-preg dielectrics and copper foil outer layers.
I would expect serious warping due to the asymmetrical stackup. If lamination of FR4 and 4003C works at all, it should use a symmetrical layer sequence. What's your pcb manufacturer's opinion about the design? Possibly you should also contact Rogers. I have experienced, that a major pcb manufacturer made a Rogers/FR4 hybrid design (a (...)
I'm making a board with a Spartan-6 and DDR2 RAM. The 256 ball BGA escape can be done with only 4 layers, but the price difference between 4 and 6 layers from pcbcart isn't that high. I saw this six-layer stackup: Milkymist One RC2 pcb Specification - Qi Should I use thi
as the impedance of the traces depends on the used material and the thicknesses of the core and prepeg layers you should contact your pcb manufacturer first. Ask them about the thicknesses they have in stock and build a stackup with these thicknesses. If you are not comfortable with doing impedance calculations you can always ask your pcb (...)
How to set the board stackup thickness and layer in allegro pcb editor. Regards, vignesh.G
I added all the layer's thickness together and found it is less than 0.06 inch Yes, thats's reasonable, it's a pretty standard pcb stackup. What's your question with it? For tolerances, the manufaturer will refer to IPC standards. You can expect a tolerance of about 10% for finished thickness. If you need higher accuracy, e.g.
Ricky, Imagine a via that has all anular rings intact through an 8 layer stackup. What you would end up with is 8 metal plates that will most certainly act as capacitors. In high speed design this is highly undesirable. Usually what is done to negate this is to remove unconnected pads on internal layers either in the pcb layout tool or in fabri
I'm doing a pcb design with a Microprocessor & few DDR2 667MHz. The recommended layer stack up was TOP, GND, INN1, INN2, VCC, BOTTOM. Can you recommend thickness of the board(prepreg and conductor layers? Impedances from the board are 50 & 100ohms. Also what will be the drill pairs from my board. I'll be using blind & buried vias. Thanks
Dear All , i am new to high speed digital design . i start reading alot of books but i didnt find any books or article that describe the all process of high speed design like when we use ibis model and how i make pcb constraines , how i get stackup data from manufacturer to use it in design. all this step can any one help me plz
I have 6-layers stackup: -----SIGNAL -----GND -----SIGNAL -----SIGNAL -----VCC -----SIGNAL the board is for PCI express cards, with differential lines, that must be impedance controlled to 100 Ohm differential. For top layer and layer 3, the reference layer is the GND layer and I can use the microstrip model for calculationg the impedan
pcb SI is initiated from inside the pcb editor program. Its' a pule down, but it doesn't actually say "pcb SI". From the pcb editor, you have to set up all the nets, power/grounds, stackup, components, etc, then initiate the program, and it will then launch sig explorer with the extracted topology (...)
Hi to all, this is the first time for me,to consider SI issues. What's the correct flow to take in this case ? I think : 1) Define stackup with the supplier 2) Define pcb Impedence (but I don't know the right value 50?...70? how I decide it ?) 3) calculate the right width trace for each layer 4) Check signals with likely SI problem and if
Hi... I am working as pcb,signal integrity Engineer.of Late I learn FPGA,CPLD design and VHDL Verilog Perl Languages.Now I want to Move to Hardware Design. I know the Knowledge of Fab,stackup design,Coponent selection Decap and termonations resistors which I learn from signal and power integrity topics and i worked on tools on these issues. ho
If you are mounting a silicon tuner onto the main pcb you will need to let us know what frequencies it will cover and what pcb materials and stackup will be used. Dropping thickness between route layer and gnd plane will reduce track widths, but you should try and do this around a core instead of pre-preg as it is easier to control the (...)
Impedance generally depends on - pcb trace width - pcb stack up for exact calculation ,u have to get ur correct stackup. then from above listed calculatiors orelse CAdstar SI verify, u can get the exact width of trace to achive the desired impedance
Hi, everyone. I have a question about the multi-layer pcb for RF passives. Right now I ran out of the space to put my microstrip power dividers and hybrids on a two layer pcb design. And I am thinking whether I can put the power divider into the other layer which is sandwiched by two ground plane as a stripline structure, and use PTH to connect
Hi All, 1.What are all the design considerations should I consider when I want to route 2.4 Ghz on a 4 Layer Board keeping the stack up as follows : 4 Layer Stack up : 1.Top 2.Gnd 3.VCC 4.Bottom. Please reply with your opinions. 2.What is Balance stackup in pcb Design? TIA., Deepak