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The time to failure depends on the degree of mismatch among all the cells for specific gravity and ESR. Eventually one cell gets weak and destroys the battery. In practise it is better to put batteries in series to reduce the the probability for peak currents which can cause accelerated aging or shorted plates. As well it makes it easier to
The question you did not answer was; Was the display backlight visibly fully on, when you measured the current? If not, it's the problem Audioguru describe. The current shunt in the meter has a voltage drop. Most backlights I've seen has a Vf between 4 and 5V, normally around 4V5. If you reduce the voltage below this, the LEDs will not go on
Hi! I am relatively new to CST Studio Suite. I am using the Student Edition, which hugely limits the number of mesh cells allowed for a simulation. In time domain calculations, for example, it allows only 30,000 mesh cells. Unfortunately, this is a ridiculously low number of allowed mesh cells and barely any of my simulations can run due to this li
I am using one of those all in one FM stereo transmitter chips. It works very well, but there is a lot of phase noise from the PLL. The chip's default crystal clock speed is 32khz, but the datasheet says the device can be programed for several crystals all the way up to 38.4mhz. Would increasing the clock speed reduce the PLL noise in any way? Is t
You reduce the ability of the transformer to deliver as much current as the current flowing through the secondary is DC. If it was a centre tapped transformer the currents in both halves of the secondary have their DC component opposed so the core does not saturate. Frank
Hi Thanks for Both.Right now Density of board will be reduce once SOC come to the PCB Right ??that time no need for More PCB designer Right ??.Nowaday people working for Density of High speed but SOC will be reduce work for PCB designer ??
Hi All, Suppose there is a long interconnect and we want to reduce the delay by adding buffers. Where should the buffers be added, at the mid point or towards the driver side or the destination side? Why? Thank you
reduce winding doesn't work, you need to increase the secondary number of turns by 50 %.
Your supply seems unregulated type, which requires a preload of 5~10% to reduce the Vpk towards Vavg. You can also reduce coil current if necessary. Show schematic and ratings.
Insert a buffer in the clock path of the capture flop. A better approach is to reduce the delay in the data path of the capture flop.
The zener clips the + base drive pulse to bypass the base current and drain the 0.004 cap to reduce the output voltage. Raising the Zener voltage increases the duration of pulse and saturate the core more.
For lower noise select smallest L and gretaer C to reduce the tank circuit's losses. But there is an optimum point while losses are decreasing and simultaneosly oscillator conditions are met.
Hi I have this small problem. I am using a 20kV transformer and not sure why this seems to require a start-up it might be to energize the coil. The total time it takes is about 5ms. Which is too long for my application. Is there a way to reduce this start-sup time or at best remove it. Attached is the scope image. [url=obrazk
If chokes are selected to reduce pulsed %THD and ripple then you must use pulse mode to test equivalent value at rated current to see if it meets design requirements. If you want to verify part value against Mfg specs, then it must be tested in same method using same; f, current source, DC bias. Correlation between the two methods depends on
Diode in reverse only works when diode is across motor to supply , V+ for both low side switches. otherwise diode across motor to gnd. for high side switch. Then driver is protected for Vmax and diode current rating must match driver for continuous current. Small cap across motor may reduce EMI. Current will be limited by RdsOn or Vce(sat) +
The main problem is with the electrode where the oxygen is given off.This would cause any metal to oxidise, in the case of aluminium, would cause an insulator to form on the surface of the electrode ans reduce the current flow. Frank
Hello my friends, I am an academician in Department of Agriculture and I aim to make growth chambers for plants which have light, airconditioning (with computer fan) etc.. One of the important thing is light intensity of chambers. So I use 9 pcs, 3W power led for one chamber and adjust the light intensity with LM350 - potentiometer system (circl
I am doing some test experiment using high gain amplifier as I have very low input. but on general pcb or on bread board I am getting unwanted signal may be due to coupling. when I am applying 3 V AC from my signal generator I am getting 200 mv at oscilloscope when generator and oscilloscope probe are 2 or 3 mm apart in a
I also agree with Klaus suggestion to keep close contact with manufacturer. If you are planing to optimize the size of the PCB in order to reduce the waste of material ( consequently increasing the amount of boards per die - reducing the unit cost ) they could inform the copper sheet and the margin required between boards in photolithography.
I am using ORIGINPRO7 for drawing my research graphs. I have drawn two columns and single row using ORIGINPRO7. I want to reduce the height of VERTICAL lines of two columns using ORIGINPRO7 and retaining same horizontal length. What option I have to use for reducing the height of the VERTICAL line. Can you advice me. I have shown below screen sh
You are essentially using a wrong modulation scheme. The IGBTs must be switched alternatingly on both half bridges, at least if driving a reactive load. To reduce switching losses and inductor current ripple, you'll preferably use an unipolar (three-level) modulation scheme. A good explanation can be found in this project report https://www.wpi
This RF oscillator for dielectric high frequency heating machine , operating at 27MHz but i ve check with spectrum analyzer that it produces much 2nd harmonic around 54MHz. The oscillator is Tuned grid tuned plate (I think) triode used is toshiba 8t25ra rating 25KW I draw a circuit diagram attached and a picture , anyone help ad
Hi, I would like to join the analog and digital grounds at only one place in the PCB using a 0E resistor in order to reduce the noise level in the design. But i stuck up with the SMPS Negative connection with the circuit. I don't know whether i need to connect the SMPS(0V) with analog section or digital section. I give the layout here.. [AT
I have cheap XD-RF-5V module. It is possible to reduce output noise when is present in missing active signal ? Thanks, Stefan
Scan re-ordering. During (after) placement, the tool reorder flops in scan chain. Just connect the closest flops togeteher - to reduce scan chain wire length.
There are several ways to do this: 1. you can use a simple divider circuit but it limits you to exact integer ratios. 2. you can use a pulse swallowing circuit that passes some pulses through and blocks others. This has the disadvantage that the output pulses are not at a constant rate. 3. you can use a pulse swallowing divider that alternates it'
Hello Everyone... I have made antenna and tuning network which can detect MiFare and HiD iClass cards. i.e. 13.56Mhz... So for that i need to control unwanted harmonics of 13.56Mhz... I have designed antenna tuning circuit as per MiFare suggest. Card detection range in around 4 cm. So how can I reduce effect of harmonics??? And what is the s
It seems that this "large via hole" is designed for minimum path length to ground. The only way to reduce RF inductance is to keep the path as short as possible, so it would make sense. Using many vias at different distances is quite useless because vias with a longer path have almost no effect on total inductance at RF frequencies.
Depends on what's "high frequency" for you. CRGO (cold rolled grain oriented steel) is preferable below 10 kHz, it's usage may be reasonable in some cases at 10 or 15 kHz. Respectively low sheet/tape thickness (e.g. 0.1 mm) required to reduce eddy currents.
I want to design a circuit using a differential OpAmp to de-amplify the voltage. The OpAmp input voltage is 250V which has to be reduced to 3.3V. Can I use Texas Instruments INA149 opamp in differential mode (by connecting external resistors) for the same? Will there be any stability issues with it since the gain will be less than 1.
1. Simplify the design and reduce the number of parts because for each part, there is an opportunity for a defective part and an assembly error. The probability of a perfect product goes down exponentially as the number of parts increases. As the number of parts goes up, the total cost of fabricating and assembling the product goes up. Automation b
There are several XMOS devices at Element 14, which do you have? Probably for one of these two reasons: 1. internally, one alone may not be able to carry all the current demand of the product. 2. using parallel grounds reduces the impedance between internal parts and the external grounds. This may help to reduce noise and unwanted signal transiti
Isolated devices are the devices which have their substrates isolated from the rest of the circuit. This comes in handy usually when you need to use S-B connection in NMOS devices, but if you use this as a design methodology you can significantly reduce the substrate noise coupling from whatever digital circuit you have on the outside. Some process
ferrite beads tend to be low Q and used more to reduce radiated noise transients or RF noise. Better way is to use 100 Ohm CAT5 type transmission lines from 50~100 Ohm CMOS LOGIC ( e.g. ALVC types) and termination R @ V/2 or equivalent Thevenin circuit with Pullup/dn if you want best speed and noise immunity. THen use large CM choke around cable
you can check the quality factor of the coil after extraction and compare before extraction , it seems that the quality factor of the coil drops significantly after extraction , why Q factor will reduce the output amplitude?
The problem with small spindle motors is poor bearing vibration and "runout" or wobble. The trick is to find a dummy spindle motor with a 0.5 or 0.75" shaft and cascade this spindle driven by the smaller motor to reduce the runout.
hi i have designed mixer using current bleeding. in this method we are decreasing current through LO stage to decrease noise by directly injecting current in to RF stage , but this will also reduce current of load resistor than how gain increases because gain = 2/Pi (gm.RL) please explain anybody have idea about it
Is there any EDA vender's simulator product can support parallel simulation of pure VHDL design ? Must take use of multicore CPU resource to reduce simulation time. Must supported by modern CPUs, not just limited by one old CPU family. Does the simulator need mannually partition or automatically ? I have read Synopsys's VCS LCA release
In some cases the purpose is to prevent static buildup. Or it may be to reduce mains hum and/or EM noise.
Hello, I am new to HSPICE simulations and might need a bit of your help. I have a simple 6T SRAM cell and I would like to reduce its supply voltage VDD for a short period of time (a voltage source). I expect the cell node Q and QB to flip after pulling the voltage supply to zero or at least to react accordingly, however they do not. What is wro
Frank, it works !!!! :grin: Thanks very much, but I have to dissipate large amount of power, about 15 mW, for delivering 1 mW power to the resistor. PAE will be very bad! Fortunately the dissipation from the source has reduced by a large amount. I can still reduce the dissipation through the source by adding small signal ampli
I am doing my research on Video Processing, When there two camera which has overlapped Field of view correlation methods is used to compress or send the video in a manner which reduce redundancy. I Don't know where to start and I need basics knowledge to be learned,From where I need to start? and is the research in this area is valuable? Pl
Solid State Relays (SSR) have integrated zero crossing and that significantly reduces the spikes. Some SSR include snubbers and some don't.
Sensing mains voltage can be of course done with an optocoupler and is often done this way. Use sensitive optocouplers to reduce the series resistor power dissipation to an acceptable amount.
Hi Everyone, is it a common practice placing an LC filter at the INPUT of a non-isolated buck converter to reduce reflected noise? does LC filter add any problem? Regards, Ballimo
In Cellular communications this is named DTX (Discontinuous Transmission). This option is used to reduce interference into the cell and reduce power consumption of the transmitters. DTX can be implemented in ANY wireless system.
There has to be a resistor in series to each LED. The value can be 220R up to 2.2K. The resistor determines the current through the LED. without the resistor the LED can be damaged or the 5V supply overloaded and voltage collapses. You can start with 2.2K and if the LED is too dim reduce the resistance.
The inductor should be a value that does not restrict 50 Hz at the current level you desire. A larger Henry value restricts (chokes) current. This may be a handy method to reduce a high output voltage. To help you calculate a ballpark figure you can use the formula for inductive impedance: XL = 2 Pi F L The capacitor is necessary for power facto
Placing ground vias all over the PCB (stiching) to improve the EMI. Have all ground vias to be spaced the same distance? Or may they be separated different distances if it is under lambda/8? I mean, I have to place ground vias all over the PCB edge to reduce EMI. The space between these ground vias are below lambda/20, aroun
Hi, after calculating the trace width for 50 Ohm impedance line, the width is 0.30 mm. 116585 There is no problem at traces but on QFN pins which have a limited spacing, could RF traces have a neck near to SMT pins without affecting too much to RF line impedance? So, RF traces fit in a prope