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23 Threads found on edaboard.com: Capacitance Multiple
Any interface capacitance will have it's effect, can be nothing or minimal or enough to disturb data transmission. It's a natural phenomina. Be clear on question.
Hello, I have a layout design in SoC encounter to which I want to add manually some extra wires to the layout (these are EXTRA and don't have anything to do with the design netlist) and modify the gap between another some wires (to measure coupling capacitance and crosstalk effects between wires). I'm using NanGate 45nm Open Cell Library.
not only inductance becomes smaller, but capacitance raises capacitance matters for a ground via? Generally, an array of multiple small vias will achieve lower inductance than a single large one and is the preferred method for inductance ground plane connections.
If you are after minimum supply induced noise in a (say) RF amplifier, you might connect the deep NWell to substrate potential, and the PWell's guardring or tap as well. This will give multiple layers of Vss-referred capacitance with no real supply coupling path. If you tie DNW to VDD and PWell to VSS then you have a large-ish coupling cap to the
I think generally you will want to stay on M6 as much as possible for series resistance and shunt capacitance reasons. A good planarized process ought to not care whether you take the stairs or the elevator shaft. But that can be a question - are stacked vias going to cost you any yield or reliability relative to non-coincident? That comes down
I don't have a circuit per se. Your quantity of interest is the charge (and probably at multiple common-mode points unless you have a very constrained application, such as an always-ground-referred (-) input). You would need to comprehend the application source impedance and stray capacitance, if you want realism and accuracy. I would set up a
There's effectively no static fanout limitation when connection CMOS devices. In extreme cases, the input capacitance might demand a reduction of serial clock frequency to achieve proper setup before the next clock edge.
The relation between driver current, (total) gate capacitance and switching speed applies for single and multiple transistors as well. In addition, you'll probably use individual gate resistors and for large MOSFETs current booster transistors.
Your simple buck regulators may be oscillating with insufficient load capacitance and low ESR for ripple or simply insufficient pre-load of 10% before the switch. Please advise if adding preload helps on stability and larger low ESR Cout Caps. - - - Updated - - - Your simple buck regulators may be oscilla
Large net length mean large resistance and capacitance. You will end up having large delay.
Most commercial DC/DC modules are using flyback for multiple output modules. It's the only way to get off without secondary regulation or other multi stage designs. Input ripple can be LC-filtered. Inter-windings capacitance and respective injected interference current are a more serious problem in isolated DC/DC, I think.
For 100KHz any aerial you build is likely to be comparatively short in terms of wave length (100KHz = 3000m). Broadcast people would erect multiple masts over a huge site with 1000's of metres of wire strung between them to try and get some "top capacitance" which tunes the aerial to a lower frequency frequency then its physical dimensions. For sho
Why is the parasitic capacitance increases with the increase in temperature?
Good RTC chips go down to a few 100 nA current consumption - mostly required for the 32 kHz crystal oscillator. Obviously, very small area transistors are needed to reduce the capacitance of involved switching nodes, standard logic gates would have a multiple current consumption. Also driving a few pF load considerably increases the supply cur
For q1: The windings of the solenoid have a resistance, so this comes in series with the inductor. The capacitance is distributed across the windings. If you consider a single layer of turns, it stays easy, multiple layers of turns have more capacitors that span multiple turns. See attachment. For q2: The equation is given is the (...)
Hi yfluo2004 Maybe I can help you. In those extreme cases the standard ESD approach is typically not the right one. Most libraries are developed for IO speeds below 0.5Gbps with ESD related junction capacitance of multiple pF's. The good news is that certainly other engineers/companies have walked this same path before and have developed spe
Yes, it's true. Stacked vias minimize the parasitic capacitance in between two different metal layers because when you put them one on top of each other, the effective area between those layers is almost zero, so there's no room for the caps to form. See attached pic. Hope this helps, diemilio
IS THERE ANY DOCUMENT/ARTICLE ON THE ABOVE TOPIC? Hi Sita, I don't know of such article off-hand. You can get an insight relatively quickly. Go to DigiKey and pick a datasheet for a falimily of passives. For example, a familiy of capacitors that has multiple voltage ratings and capacitance values and package sizes. T
Hi, Remember that there is no capacitance in simulink. You cannot simply use transfer function block for the opamp. You should model the integrator in system level. But how? Any suggestions?
depends on power noise and current timing for consumption circuit and also frequency of current consumption. for high freq pay attention to capacitor inductance which is high for MLCC capacitors , (some low caps connected in parallel to high capacitance caps). To decrease the inductance of caps multiple parallel connected caps are used as well