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6 Threads found on Cmos Ground Connection
Hi, I am majoring in analog RF design, but I'm confused about the future of this technology, could u help me analyze it. As we know, now 28nm process technology has been used in digital design,so which level of the process technology will the reached in the future and how fast will that happen? In the future the process technology may bec
cmos - ground them LM339 - ground one, leave other open or tie to VCC (open will pull up).
I just used the automatically created layout of a ESD diode in cadence. I have to connect the diode between gate of a cmos transistor and ground. But I don't know which layers I can use to connect them. Can anybody help? I use the SG25 cmos technology. the one terminal connection to the gate of the device
The cmos FETs are actually 4 terminal devices, source, gate, drain and body. TAP cells provide a low resistance connection path to the body. In digital circuits, body of MOSFETs are usually connected to the power or ground. That is why if you look closely at the digital P&R layout, you'll see the TAP cells are usually on the power rails of (...)
2. The very important thing is source to ground connection should be very short and wide to avoid ground inductance which will kill your gain In fact for cmos design, the ground inductance is mainly contributed by bondwire and the lead of the package. For design in GaAs technology, TWV(through wafer (...)
Dear all, What is a typical value for the resistance of the substrate connection of each MOS in a 0.35 cmos process? I am talking about the effective resistance that, for instance, the bulk terminal of an NMOS will see to the ground line, when directly connected to it (like the typical NMOS with source and bulk tied to (...)