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460 Threads found on edaboard.com: Copper Pcb
Hi all... I have a issue regarding tin plating on pcb's. I am making pcb boards since long for my personal use but the copper on the pcb gets oxidized very quickly, so i am planing to tin plate the pcb. i have even tried electrolyte tin plating on pcb's but the traces peels out when the (...)
I have done these devices with the pads 1:1. Even though they show the pads smaller when these devices are put on a board they are connected with maximum copper for heat sinking purposes so with the recommended solder mask opening you effectively get a 1 ;1 pad. So I use IPC-7351 standard and use a 1:1 pad with a 1:1 solder mask opening and get the
^- This indeed could be at least part of the problem, especially if you had some composite parts (such as separate inverter gates represented in the schematic) for a single HC04. Another issue could be related to copper pours/polygons that may have been assigned to a net and used to connect pins on the net, instead of distinct traces. Alot was cha
There are many GND Vias between RF traces, but In the middle of the GND plane, some vias each have a black square(copper removed) next to it. 135956 What's the reason behind this design? We are considering follow the EVB's design in our project. Any help will be greatly appreciated!
There are many GND Vias between RF traces, but In the middle of the GND plane, some vias each have a black square(copper removed) next to it. 135955 What's the reason behind this design? We are considering follow the EVB's design in our project. Any help will be greatly appreciated!
Hy I am designing a power distribution board using the OR-ring topology. The board has to carry about 34A per contact ( and 140A in the common nets. In order to route the power nets I have used a copper pour area in all the 4 layers. I plan to use 70um copper for both external and internal layers. I have checked Saturn pcb (...)
Hi I would like to know which thickness I should apply when they don't mention it inside an article. I want to design an antenna of some ieee article . They said that the substrate top side is a copper coating also acts as the ground plane for the open microstrip line (feed) which is etched on the opposite side of the substrate but hey didn't m
As FvM already stated, the easiest way to do is using blind via's from layer 1 to layer 2. An other option is using a double core construction. Instead of using one core and two copper foils you can also build a 4 layer board with a double core construction. Contact your pcb manufacturer. They know it all.
134515 I think you are not creating the PDF correctly. Use following method: 1) Click File > Print 2) Select PDF as shown in the attached image 3) Select the desired layer. You will have to create one PDF for top copper layer and one for bottom copper layer, seperately. Say, you only want TOP layer fir
Hi, Did you try to find the information on your own? (I doubt it.) Where? At the place where it is produced: the pcb manufacturer. A simple search "pcb copper thickness" gives many, many, many results. Often you find: 1oz Cu per square foot, 1.0oz. = .0014″ (35 microns) , 35um, 0.035mm Other thickness for sure
Thermal pcb design is always an interesting problem. These days there are many solutions dependant on the circuit complexity and how many layers required to get the routes in. I recently did a 12 layer (all 2 ounce) flexi-rigid layout with numerous D pack and similar devices, lots of copper pours and thermal vias. The best use for metal clad is sim
what is the aproximate area of pcb copper required to dissipate the heat?
All the component calculations, at least up to very high frequencies are identical. When the frequency is very high, the calculation stays the same but the effects of wire leg inductance and package capacitance may have to be taken into consideration. Heat sinking with SMD devices is normally achieved by soldering the tab to a copper area large e
Here have some measures, please check whether are right? If have better measures, please advise. 1. Exposed copper: There is no timely processing out of oil area; 2. Not balanced IC Sn surface: Don?t carefully checked IC area after Hot Air Leveling; 3. Repair: Worker single-handedly take-off and release board to make boards overlap each other
We are a professional pcb manufacturer( ) in China and certified by ISO and UL approved.We focus on : 1 . 1-30 layers for rigid pcb fabrication 2. 1-10 layers flexible-rigid pcb. 3. Metal core board, Heavy copper board ,HDI board . 4. quick turn pcb service: finish 2 Layers in 24hours, 4-8Layers in (...)
I prefer to generate a separate "outline" gerber file. Positive copper artwork layers shouldn't contain board contours, they need to be removed by a CAD operator manually.
Advanced pcb companies (including pool providers like Multi CB) have 200 ?m structure size for 2 oz copper which would still work with dual row 0.4mm BGA. But a brief look at the TI product selection shows that are also similar types in SOT23 etc.
The appended dxf is useless because it has all data in a single layer. pcb layout data must have separate layers for each copper layer (apparently 1 in your design) soldermask(s) silkscreen ("marking") board outline drills Drill data must be probably manually converted because a file with x/y coordinates and tool number is expected. (
Hello, I'm just routing a simple board with SigFox TD1207 module and antenna. pcb 2 layers, thickness=1.6mm, copper layer=0.018mm (top and bottom) I need to control impedance line for antenna, must be 50 Ohms, on the bottom layer GND Plane. I'm using Altium, specify a pcb Rule (impedance = 50Ohms), but it seems doesn't work, (...)
Hello, Just designed and manufactered my BlueNRG-based pcb on ******, see attached picture for a 2-layer pcb with a pcb antenna works at 2.4GHz. pcb specs: Length : 55 mm Width : 30 mm Quantity : 10 Layers : 2 layers Thickness : 1.6 mm Surface Finish : HASL with lead Finished copper : 1 oz Cu Solder (...)