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48 Threads found on edaboard.com: Density Rules
Is there anyone who's used UMC 28nm for analog circuit before? In this process, the POLY high density checking window is 1mmX1mm stepping 500um, is that possible? It's a big question mark.
An auto-generated layout probably has no taps, hence tap-density type errors. It's telling you "OK, your turn to step in and finish the job" most likely.
There may be application specific reasons to set different defaults for individual spacing constraints, asking for a general answer doesn't make much sense however. If track to track spacing is marginal, you may want to mitigate those constraints that are not essential for design density. A trivial explanation could be that the DFM rules had been e
Use foundry provided density rules - as freebird stated above.. these are kind of DRC rules.. Calibre, PVS, Assura can do a density check. Back to Basics: Metal density - is a point function, and therefore various functional representations are possible, {there is nothing like absolute value of (...)
The density rules allow are aimed for DFM (Design for Manufacturability), so overall you should try to make them happen. See this article. You don't need to fill them with "active" metal, you can usually 1) fill with metal and ground it --- make sure to not add extra capacitance to
I see no reason not to, but depending on how the density rules are constructed you may or may not get a benefit (global density, vs an anywhere-window that requires density to be met within any field of view). That, and since contacts mean metal you would be walling a potential routing lane(s) - maybe you want to map out (...)
You should have a different electrmogration rule for AC (zero average), which Irms would index rather than Idc. Irms of course works fine for DC signals against a DC rule, too. You just have to make sure your basis matches your application. Irms may also pertain to resistor power-density rules, similarly.
1. consider the maximum current density of your metal in the specs. 2. place 10 x 10u metal traces in parallel 3. you can also insert slots on yourself. But if they are nice, they'll ask if it's ok that they will do. Also they just check design rules and give it back to you in case of violations. And yes, it's because of metal density.
Where do find the pdf for current density rule in PDK. Usually in the Design rules or Electrical rules.
Automatic insertion of metal to meet the metal density rules as specified by a foundry for a given placed and routed IC in 28nm process is my project as of now. And I need to know certain stuff as I have no idea.. 1) Why do we prefer ASIC and full-custom designs rather than FPGA ? 2) I need bit of Understanding o
STI, shallow trench isolation, is more repeatable and finer than old-school LOCOS. Packing density is the goal. But it can come at a cost because the trench and refill can add higher stresses / strains that make devices sensitive to local geometry. density rules are for lithographic field loading, and at some extremes of sparseness the (...)
Questions : 1. Why do we have STI ? specially in lower technology nodes compared to larger nodes ? 2. Why do we need to meet minimum density rules ? What's the issue if density is low at some areas causing a groove during cmp ? Why is the planarity needed ? 3. What is requirement to put dummy's at top and bottom more stringent at lower (...)
This all depends on the signal attributes of interest. Typically upper levels are thicker and may have looser layout rules (esp. in RF and power oriented processes) so routing on M9 will cost you density. Routing on M1 will cost you more series resistance, capacitance to substrate, and impose a lower max current density (metallurgy being (...)
Pattern density is a way of setting a minimum uniformity of etch-loading, especially older wet etches suffered from depletion of the active etchant in areas where more material is being taken off, less where the load is light, leading to local variations in W, L of whatever layer is in question. I'm not sure whether these rules have "gone away"
usualy poly density is about 15% per die area and metal about 30% - and higher. For min max you really have to pull out the process rules.
At some point film stress / strain can become a reliability issue (forming hillocks, hurting planarity and maybe even photolithography). There is also a local layer density upper and lower bound, which a semi-infinite slab would violate. Above a certain width you ought to see slotting rules that force these issues back into their "box". The rul
HDB3 ( High density Bipolar 3) is used primarily in Europe for 2.048MHz (E1) carriers. This code is similar to BNZS in that it substitutes bipolar code for 4 consecutive zeros according to the following rules: If the polarity of the immediate preceding pulse is (-) and there have been an odd (even) number of logic 1 pulses since the last substit
Typical VIA current density is 1mA/VIA
Metal current density is usually evaluated by mA/um. For many processes, it is around 1mA/um for continuous current.
Hi Frenz, Please help the current density formula in ibm65 .