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32 Threads found on edaboard.com: Dummy Density
Hi. I am using TSMC65nm design kit and Calibre for DRC. I am facing two general violations that I would be thankful if anyone can help with. I am doing DRC for a simple fill cell (5 um x 5 um) that contains all the metal layers and vias. There are the errors: 1. "It is not allowed to have local density > 0.8 of all three consecutive metal layer
If there is a option of placing dummy metal layer, you can use it. While fabrication, those dummy layers will be filled with corresponding metal layers, but beware of parasitics.
Dear friends, I am working in RF circuit design project using 65nm tech. There is strict requirement on local metal density. Auto-fill utility can help but greatly affect circuit performance. Manual dummy metal fill is used but it seems not very useful. Any suggestion?
Dear friends, I am working in RF circuit design project using 65nm tech. There is strict requirement on local metal density. Auto-fill utility can help but greatly affect circuit performance. Manual dummy metal fill is used but it seems not very useful. Any suggestion?
I am actually writing a calibre rule deck for 28nm, which shuld check for metal density violations and fill dummy metal to overcome violations automatically.! so I some need assistance with this. When i check density command on test case with only metal1 inside pr boundary, i am not able to figure out how is it computing densities and (...)
Thanks for your time dick_freebird. I have one more doubt.. I know that The fab has specific rules for fabricating IC s which have to be met by the design engineer ,one such rule is METAL density RULE The IC(say Ic with 2million transistors) with more number of transistors has more metal compared to the other IC( say 1million transistors). But acc
Hi All, please advise the first steps in study in packaging area for ASIC designs. books (IC Layout Basics - A Practical Guide?)/approaches/etc for example what are the key advantages of flip chip against wire bond? in case of io placed on perimeter of die, with low lead number. does it mean that it's not neccessary to use flip chip, is i
Questions : 1. Why do we have STI ? specially in lower technology nodes compared to larger nodes ? 2. Why do we need to meet minimum density rules ? What's the issue if density is low at some areas causing a groove during cmp ? Why is the planarity needed ? 3. What is requirement to put dummy's at top and bottom more stringent at lower (...)
As I know there is no relation between CTMDMY layar and density error of DRC!!! CTMDMY (capacitor top metal dummy layar) is a dummy layer to specify your capacitor area, which is useful in LVS process. The density DRC error is an error which is occure when the density of a metal is less than a percent (...)
Check if your foundry (or MOSIS?) will do the dummy metal filling for you, or if they will provide you with the appropriate software tool (e.g. skill routine or DRC rule file).
these all are density errors which can be cleared by filling with dummy metals at chip finishing stage. Some times the foundary does this dummy filling. SING
Hi, Nybody know which layer to use in SMIC for dummy exclusion for density checking ?? I tried MnSLOT layers.. but it is not working... working as metal layer.... (LVS) Deepak.
dummy poly, and increased poly density near that area will help
As per my knowledge, Going to down technologies following are the some of the issues we critically find out.... 1. WPE 2. LOD 3. density. 4. Lot of DFM and Yield related rules. 5. More conservative OPC rules. These are upto 65nm. But coming to particularly 45nm, In some of the foundries I heard there are problems with dummy poly usage and
Hi knack - there's many different way to fix density errors... 1. if it's metal density you can make the width of the metals set to more than minimum distance. 2. You can add dummy metal pattern as well and distribution must be equal. 3. If it's in block level just ignore it because once you instantiate your block on the top level (...)
Yes, putting lateral dummy fill metal in series act like many caps in series and have higher capacitance than w/o any metal But that is not allowed because of the rule restrictions But the questions was to connect to ground or let floating. And here series caps give less load than grounded fill metal!!!
actually this is the DFM requirement. it is especially important for the YIELD. you can fill dummy metel or widen your power bus to fix it.
To account for copper's side effects, physical design tools insert dummy metal patterns, called metal fill, so that designs meet the required metal density " as specified by foundries " to reduce the thickness variation. WHat is exactly this dummy metal ? wher it is connected ? Can somebody explain how exactly this (...)
Hi, When I run DRC, there is density error. But I don't want foundry auto fill dummy metal in some part. Which layer (layer name & type in LSW) should I use to block those part? Thx
1,U need to add dummy metal 2,i don't known :)