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92 Threads found on edaboard.com: Filler
Using the ECO flow is kind of advanced design technique. You are still struggling with really basic concepts. I can bet your restoreDesign command is pointing to the wrong thing, and your eco.v netlist is not "physical", therefore does not contain filler cells, welltaps, etc.
It seems like you have asked the same question a million times already. What have you tried on your own to debug the issue? Have you read any documentation from the tools? Do you know how the mapping file format works? If not, why not? It is all described in the Encounter documentation. This missing filler cell issue for instance. It is incredibl
1. To check filler, please check your library level LEF file. There for filler's you will define a particular CLASS eg: MACRO FILL1 CLASS CORE SPACER ; ... You can go through the different classes to understand the Category of the cells in the design Adding from Comments @ThisIsNotSam : 2. Spare cells. Terms might differ. In some context, these
Hi, I know there are multple threads about this question. But did not find what was I looking for, I know Endcap at the end of rows and around macro, fillers in between design to fill the gaps n well continuity, and Decap for IR drop to give exra capcitance... My question is what End cap has so special that it will be placed at the end of
Hi All, Which type of filler cells should add in soc encounter,I have fill 1,2,4,8,16,32,64 sized and for well tap and end cap also the same values. Which size should i add ?? also while adding end cap cells,it is asking for precap cell and postcap cells ?? What i shud specify among the cells differently ?? (same fill 1 2 4 8 16 32 64) Ho
Hi all, If I add the metal filler in the region of core whether the metal filler are added on the top of macros(e.g. sram or other analog circuits). I have asked my friend, he said the metal filler would be added all over the region. But it was added all the region except the top of macros, I want to confirm the problem. P.S. There (...)
Microwave ferrite has much lower permeability and more conductive oxide filler. <30MHz ferrite has the highest mu with cobalt doped iron oxide with much less conductive metal particles as beads around conducting wires. But high permeability and lower resistance SMD in a ferrrite power may use silver oxide with iron oxide and is more expensive. Bu
Did you add filler cells?
End cap cells usually go at the end of each row and contain decoupling capacitors. filler cells are used to fill unused spaces in each row (i.e. where there are no logic cells) and just have metals to connect the horizontal power rails.
Hi, filler cells are added for n well, pwell and metal 1 continuity. Why should n well p well be continuous ? I understand that Metal 1 should be continuous for min density reasons and EM reasons. What exactly is power continuity ? Thanks in advance. :-D
Hi all, Please can me someone explain differences between these terms? macro cell filler cell ECO cell all are taken from TSMC 90nm PDK documentation. Thanks a lot.
As from the definition of ESD you can understand that uncontrollable current flows between source and drain which only stops when transistor breakdown happens . So that means ESD can destroy your whole chip. This ESD is also known as Latchup. so to overcome this we add filler cells which make the n-well continuous this means we get a continuous
Standard Cell Site & Unit Tile: is the minimum width of the small largest cell, generally the smallest filler. The terminology difference could comes from different backend tool (Astro-ICC versus SE-SOCEncounter). Placement grid: the grid is generated by the backend tool based on the unit tile.
when i finish route in icc,use the insert_stdcell_filler command to insert filler cell, the tool reports : Error: cell *** was not placed on row also in the log it says there are 52 cells are overlaps or not placed on row,is anyone meet this error before? how to fix it
Hello Guys, Recently I studied some where regarding filler cell like this can any one please explain the following statement in detail. filler cells also provide decoupling capacitance to complete the power connections in the standard cell rows and extend N-well and P-well regions. Previously I thought about filler they will pr
well, normaly the std cell library provided some filler cell to fill the n-well and power rail between two std cell. but this step should be done by the PnR tool, not in virtuoso, or do you made a small block in the analog tool env? The filler cells are here to respect the DRC between two std cell not abuded.
Hi, Yes of course this filler and capacitors are needed to be included in the design is used for device encapsulation and to avoid uneccessary effects of fields that causes the chage in Bulk(silican die) properties... and you can route to VDD and GND using place and Route tool.. Thanks,... - - - Updated - - -[/SIZ
The filler cell are required to have a continuous n-well between each std cell, and certainly fix this latch-up DRC.
hi friends, i have one doubt. we are using filler cells in between physical design flow right, and metal filling is used at the final stage. what is the difference in between these two?? can any one explain on this
Hello people! I am trying to do floor planning for my design for the first time. Actually I have done the basic fllorplanning and have placed the i/o pads as well but not the macro cells ( placement in the core area) yet. I verified the geometry after this step and found a lot of spacing violations and short violations at the corner pads. I cor