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11 Threads found on edaboard.com: Flip Chip Pad
Hi Can anybody help to explain how to assign excitation for this two pads, basically i want to simulate the flip-chip bump. I have assigned ground plane at the top and bottom faces of the dielectric materials. but they are not touching the bottom face of the bottom pad and the top face of the top pad, (...)
Does any know about flipchip IO pad? In our cadence design kit, I only see IO pad cell for wirebond chip, I think it's not suitable for flipchip, so anyone who has designed a flip chip pad please give me some information, (...)
Bond pads are large flat metal pads at the top surface of the IC (typically 50x50um or larger). These are used to attach bond wires from the package frame to the IC. The bond wire is typically gold or copper and is ultrasonically welded to the pad at final assembly. Where the bond pad is used for solder bumps (...)
Hi all! Can anybody help me about flip chip pad and opening at the die side? We are going to design a SOC in FC, my problem now, are the pads and pad openings are the same size for die side? or the pad opening is smaller than the pad? Thanks in advance!
AFAIK there's no difference to standard layout: the bumping service is done afterwards: 20..25?m isolation layer over the passivation, window etching down to the pads, bump metalization by electro-plating, (flip chip bonding). Each bonding pad needs an ESD structure which can stand the necessary electro-plating current (...)
Use staggered pads instead of inline pads if you have them. Use flip chip instead of wire bond. Thx. I have used staggered pads. flip chip will need more money. And I am not familiar with the FC‘s backend flow。 Can you tell me the difference between (...)
Hi, I thought it is always possible to put circuit under the bumps? The more complicated flip-chip has the pad driver inside the core also. In this case, it is obvious that the area is taken up by the pad and not core logic or macro can be placed there. Regards, Eng Han
1.about I/O circuit,How to choose the pad for test?Beacause of the high speed output,do I have to choose LVDS pad? and is the speed of the I/O important?If i decide to design pad myself,what should I pay special attention for? 2.about package,because of the high speed output,do I have to use flip chip (...)
1.about I/O circuit,How to choose the pad for test?Beacause of the high speed output,do I have to choose LVDS pad? and is the speed of the I/O important?If i decide to design pad myself,what should I pay special attention for? 2.about package,because of the high speed output,do I have to use flip chip (...)
pad limited design means your design has too many pads, so that the silicon area is not fully utilized. This is not cost-effective. To solve this, you either add function to your design or try to find IO lib with finer pad pitch, or use stacked pad, or flip-chip solution. Core limited is (...)
This CMOS process has 5 metal layers and 1 poly layer. The process is for 2.5 volt applications. A thick oxide layer can be used for 3.3 volt transistors. Designs for this process require Metal 5 in the pad stack. flip chip bumping is available from MOSIS. Please send e-mail to for more information. Use 2.5V