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Metal Conductor Thickness

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Hello, Does anyone know what is rule of thumb for maximum current density on PCB tracks (Extracted from a DC Drop Analysis) ? I know for wires is usually 500A/cm2. How do I know if a local hotspot with 2000A/cm2 or 5000A/cm2 is bad or not. Thanks
Hi, I want to make a welding pit, dimensions 22cm X 11cm X 3cm in stainless steel As a heating element I have this resistance of Kanthal, to be wrapped around the welding pit ... while as insulation using glass wool or ceramic fiber. If I use 30mt o
Hi can anyone explain what is the metal stick sticking out of the screw and what is it for? I found it in a air purifier device.
As you know, foundry use 2 masks successively to make one layer on chip, so each metal will have 'perfect direction', same masks with large space compared with different masks with small space, of course some forbidden space and width. For more details, you can check foundry design rules.
Shared diffusions are used everywhere, even in very advanced nodes (such as 7nm or 5nm), so it's not a universal rule. Indeed, what you say makes some sense. When a diffusion area is shared, the metal interconnects connected to that diffusion area carry double the current (as compared to one transistor case). These interconnects have high resistan
Hi, The ACS772 hall effect current monitor family can measure up to DC 400A, but its abs max current is DC 250A?As such, we are looking at the LEM LF 505-S Hall sensor? LEM LF 505-S Hall sensor? How come the LEM is for says it has a secondary winding
Thank you very much for your reply. Can you please elaborate on why keeping poly unidirectional and aligned will help in pushing the process technology further ? What is the meaning of gridded ? poly is unidirectional for many years now, it is the only way to keep pushing the process technology further. not only
L1 output pin  uses M1 for output pin + 2M0 vias to M0 straps L2 output pin  uses M2 for output pin + 6 M1Vias to 6 M1 straps + 12 M0 vias to M0 straps  lower cap than L1 L1 input pin  uses M0 layer L2 input pinuses M1 layer 1 M0 via to M0  lower cap than L1 I have these two layouts, both
Hello, I?ve got some issues identifying a SOT-23-6 SMD labeled ?BMFAD? while reverse engineering some pcb. I?ve seen the same circuit, where this thing is also labeled as ?BRYAA?, which I think only differs in some voltage values a bit. It has the pins 1,2,5,6 connected to the positive voltage, pin 3 connected to the ground (via a 10k resistor,
Hi, I am trying to simulate the radiation absorption in a thin-film patch on my wafer. I modeled it as a rectangle finite conductivity (boundary, solved both sides, DC thickness given) patch and calculated the integrated loss. I am most interested in 100s GHz to a few THz. The result I got matches very well to the theoretical calculation (modifi
I am given a DEF, didnt create it myself. I was able to view the DEF in ICC2. I selected a specific layer (M1), and selected OPC and Area fill shapes. But I dont see any of the FILL shapes. If II select "Fill cell", it highlights the entire cell, and not the shapes inside of it only. When I stream out this DEF as GDS using ICC2, I can see a f
There are of course many papers and many foundry marketing presentations showing anecdotal data (or wishful thinking). Go fish around ieeexplore and then go find those papers elsewhere, if you don't like supporting publishers who pay their authors nothing. When you get to the lower end of your range of interest all bets are off. You could have S
Ive worked in some 35 different electronics hardware only one did we have to wear ESD overcoats. If you have an esd mat with wrist strap , and an esd footstrap and esd flooring, is it still necessary to wear an esd jacket? Can this be worn over a wooly jumper? ............. Also at 2:06 of the following esd video, they use a
Hi I noticed some other posts on here about APC UPS and it seems that some posters have good knowledge of this kit. I was extending my (working) UPS to use a larger external 12v battery with long cables and had put it back together again with the battery in. I had turned it upside down to solder the last croccy clip on using my Helping Hands st
312-343C is certainly high; anything greater than 300C is not recommended for soldering electronic components. In one of their videos, they show the working temp to be 500 (should be in F) which is close to 260C. Common solder melts around 200C and pure tin around 230C. Excessive temp at the soldering tip will cause rapid o
Hi I am here to share some unusual PCB features encountered in previous pcb production.These may help Makers use your imagination in PCB design. PTH on the Edge It is also called ?castellated holes?. These are plated holes cut through on the board edge and used to join two PCBs either by direct soldering or via a connector. During the produc
The following shows the kit and effort thats regularly needed ..surely a metal pole sticking up from the top of the stantion would be cheaper
Hi Edaboard community, I am trying to simulate a homogeneous CPW structure using HFSS and for exciting the quasi TEM mode of this structure, I am defining wave ports at the ends of the structure. I have computed the Poyiting vector at the surface of the wave ports; and I notice that the value is not always the same and that for certain freque
Design For Manufacruing rules are set by the process fab and they recommend using them to improve the yeild and relibilbilty of a chip. The rules would recommend usage of straight and 45 degree angles, double via usage and metal paths than minimum, eg 0.18um path coule be 0.2um (>10% increase) Although following minimum design rules and LVS is rea
there are few reasons we use inductor. for Impedance matching, DC biasing(RF choke), Phase shifting, Filtering, LC tank and when I design inductor in the HFSS, the values of 1port(single ended) and 2port(differential) are different. 1port(single ended) inductor spec: L= 172pH, Q=19.6, Fsr=122GHz 2port(differential) inductor spec: L= 152pH,