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26 Threads found on Metal Filling
It's a metal hatch filling in order to increase the stress capability of the chip.
greetings for the day. 1.which metals are used for metallization and contact between layers of a layout. 2. can we use normal metal for contacts instead of using tungstun which having high resistance ranges from (2 to 20 ohms) because metals have less resistance normally .02 ohms
Hello! I would like to know whether the vias in the SIW are as an empty cylinder with only metallic walls connecting the top and bottom layers or they are totally filled with metall? if the vias are not filled with metal are they filled with the same substrate dielectric ?or not? I hope you could help me to clarify those confusions as I (...)
I see no reason not to, but depending on how the density rules are constructed you may or may not get a benefit (global density, vs an anywhere-window that requires density to be met within any field of view). That, and since contacts mean metal you would be walling a potential routing lane(s) - maybe you want to map out any likely-useful chann
Dear All, When I check the timing by doing time analysis just before filling I get no violations, After applying the filling ( metal filling ) I get four hold violations. Does anyone have an explanation about the effect of metal filling on timing?! I tried to do timing optimization to (...)
Hello all, metal filling is done after the design is complete to keep an uniform metal density to avoid dishing and erosion effect during chemical mechanical polishing. But metal fills, we used are floating or connected to power lines? which is types of metal fills normally used?
metal filling should not impact the timing if you have enough space between nets and the metal filling. Connected the metal filling to ground or power could help to reduce IR-drop.
IR drop, is close to EM, and this could be solve at floorplan phase with a good power structure, or with the metal filling after the routing/si phases.
Electromigration, is it due a high current during a long time, which will move physically the metal, up to open the power net. To solve that, made a good flooplan which well design power nets structure. Some one used the metal filling connected to power nets (for example odd layer to ground and even layer to supply) to reduce the (...)
Do yourself the metal filling and do not request the foundry to do the metal filling. Or used the metal block layer, for example in TSMC the sub-name "blk" is for each layers.
To complete the point c, you could connect the metal filling to power nets, that will also reduce the resistivity.
hi friends, i have one doubt. we are using filler cells in between physical design flow right, and metal filling is used at the final stage. what is the difference in between these two?? can any one explain on this
Hi folks, I am working on a 28nm project, which requires auto metal fill for our chip. After googling, I know that Calibre is able to do auto metal fill. But I have not found any commands or scirpts concerning how to do this. Can you give me a hint or any comments about using Calibre. Plus, Calibre SmartFill can do this as well, but we have no
I am using tsmc90nm. I use autofilling tool provided by tsmc to do filling. When I didn't merge the dummy metal created by that tool, my lvs was correct. But when I merged it, mimcaps and several pins were not correctly bonded. Any idea why? ( My lvs with the merged dummy metal used to be correct). And my drc is clearn.
Hi, Usually mask layer will merge dummy & normal drawing metals using equation metal1 = Dummy_metal1 OR Drawing_metal1. I believe the original concept of automatically creating dummy metals for fill shapes was the reason Dummy layer type was created. If the fill shapes were to be automatically created, then (...)
metal fill will add coupling capacitance to the actual routes and hence cause timing disturbances. Based on designs that I have worked on so far, this impact will be very less. Typically we will have enough signoff margin to cover those.
Hi Chandra, If you get thousands of Errors the problem may be one or more of below points; 1 - Floorplan objects (power straps, missing tap fillers, overlapping cells, etc...) 2 - Latch-up Errors that may be caused by missing tap cells 3 - Density errors as I guess you have not do metal filling. 4 - Or any other problem
Check if your foundry (or MOSIS?) will do the dummy metal filling for you, or if they will provide you with the appropriate software tool (e.g. skill routine or DRC rule file).
metal fill is done to avoid electromigration effect.