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Hi everyone, i need to create this Die package.N-channel power MOSFET has Source ,Gate and Drain pad need to create but in this datasheet ,i have pad size for Gate (widht not mention for Gate) and Source,but Drain mention as Back How to create this Die package. Package
Use a pad attenuator at the mixer LO port (which most of the RF mixers use) and this will solve all the impedance matching issues at that port.
Hi everyone, To have a symmetrical supply power of my design, I have put the VDDA to +1.65 (techno AMC c35 3.3V) and VSSA to -1.65V. And I have several blocs that have one node to GND=0V (for example the positive input of the integrator amp-op). As I have finished the circuit layout, I want to add I/O pads to finalize my circuit. I have differen
Hi I am looking for a rework station for soldering and desoldering of IC with power pad. That is IC with metal landing at the bottom for soldering onto the plane of the pcb for better heat conduction. Thanks Alan
That isn't a large current or large power and nothing you mention is likely to impact package size at all - seems like everything you mention could fit under just one bond pad. Now, if this is for a classic "4-20mA" interface, are you sure 1.8V of headroom suffices? Do you have a common mode voltage or ground-offset spec to meet?
I think multi-band. Because of mobile phones (2sim gsm+cdma+gps+bluetooth). maybe. But more recent papers focus on beam steering, something like wifi wich alters beam direction to point in your phone/notebok/pad. To reduce interference, focus power, increase speed.
also sounds like you may have a noise issue , with high di/dt current pulses going through your control ground. The source sense res ground pad needs to be your control connect that to the chip ground so they are one and the sane at all times....don't let power switching current run through lengths of control ground. You may also nee
I use multiple external hard drives with my current laptop (3TB (3.5" USB External), 2TB(3.5" eSATA External), 1TB (2.5" 9.5mm tall USB Hub Cooling pad), and 1TB (2.5" 12.5mm tall USB HDD Shell). the 1TB (was unpowered) in the shell fell out of my hand while shifting my laptop, cooling pad, external hdd, and power cord (...)
Hi, I have an idea here to power a PC fan cooling pad that runs on USB(5V). The power source is from an AC powered smartphone usb charger as shown here. My thinking is this will WORK if the data cables on the the pc fan cooling pad is
Limiting the current, but also ensuring that it spreads evenly so as to avoid hot-spotting and local power density related physical damage. Pullbacks (with salicide block) are the norm in ESD protection device design. They should be used on all pad-connected drains / sources. PMOS may not be self-survivable (i.e. its own D-S breakdown is low en
you are assuming that the buffer amp does not reflect any power, when in fact if reflects power and can even send spurious signals out of the input port. Put a 3 dB pad between the two and the effect will be much reduced.
Hi Sunny, Yes, R-creates the Joule heating. I have 0.44ohm on vss to clamp and 0.5 on vdd to clamp on Z layer. So, total 0.94 ohm from vdd to vss pad which I guess satisfies ESD rule (<1ohm). 1) Does this 800um (pad to pad) current path can tolerate with esd current? 2) Can we connect Bump pad sitting on IP to Internal Powe
Because 10dB pad will have a return loss of 20dB adding one helps to ensure that the impedance seen by the DUT is close to 50 ohms resistive. 73 Dan.
What - exactly - is your problem? More info from your side is necessary: Got the pad frame? With existent power supply pads/rings and I/O pads? Are there other cells besides your LNA (to be) connected? Can you show a picture of your cell and the pad frame?
Designing a 4-layer board (signal+pwr, gnd, signal+pwr, gnd), and I have some newbie doubts about the best option to connect different connector's pin or IC's pad to power lines, or sometimes to different signals. Board has different parts: power, MCU & RF. The main issues I have: power at connectors. Which is the design g
Hi all, I've a problem with Altium 15 at the end of PCB routing: Once routing was done, a "from-tos" line (one ratsnest) remain on the screen. It link an object connected with VDD (smd pad, or also a with a via through power plane (VDD)) with something that resides off-screen. No way to see what kind of object is because the line go away from
The two lines that form a V are relief copper connecting the pad to the power plane.... You have your pad relief set to 45 degrees. Two points components are soldered... Very little tin/lead solder is used these days, RE. RoHS 2006. how come when I probe them they are Not listed as Clines or Cline Seg?
Hi I have a tpr file that it is a description of ALU.I want to make layout for it with cub library(cub.tdb file) in Tanner L-edit,but when I try to do this with SPR, it makes following error: SPR pad Route setup: pad route i/o signal layer and power layer must be different. please correct spr pad route setup> layers. (...)
square, you have more space in the core area if you have pad on four sides.
Have you something called "route offset" (or similar) in the settings? If not then add some copper to the pad so that the route comes into that, stopping before the pad perhaps?