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Thanks Shalin. The below update has been done in SGDC, it helped in shift violations but not in capture violations. Still I am getting violations in Capture - "Reset/Set to XXX flops is not controlled in Capture Mode" Reset Scheme is as below - IO --> pad --> Scan Mux --> Flop Now I have defined the constraints as below
TPS54528 has no feature to reduce the switching frequency, in so far it's some kind of irregular operation. The SW waveform suggest insufficient or too distant bypass capacitors at the VIN pin, did you follow the layout suggestions? By nature of the buck converter, the output current is commutated between VIN and GND, you need sufficient bypassi
Hello, I have designed a custom development board for DSP controller. The power circuit (delivering 3.3V to the board) I have used is not working. I am sharing the power supply circuit schematics. 157108 Till now I am thinking that while soldering, the IC get destroyed due to which it is not working, but I am not sure. Pl
Photo resolution is too low to see details. Would prefer a microscope photo with diffuse lighting. To me, the pad surface looks partly like silver metallic rather than white. What's the gold process? If it's nickel-gold, could it be that the final gold layer is damaged?
Hi, The following XC8 C Code just reads the ADC input?then if above a certain value, it then outputs a PWM out on a pin. Do you think this code is OK? it builds fine. The ADC had loads of registers and it didnt look like you had to bother setting all of them? It would be good if microchip had like an "LTspice simulator " for their microcon
Hi, I want to use pcb relay to control(on/off) the submersible motor-pump of 5 hp with MCU control. for that, efficiency = 85%, pf=80%, at 230v, the Continuous current(I) will be, Input=o/p / efficieny = 5/0.85 = 5.8 ==6 hp x 746 =4.476 kw. I= 4.476/(230x0.8) = 25A running current. --As the starting Amp of an Induction motor are 3 to
Hi, attached is the input circuit of a spectrum analyzer. I want to build a 60dB 1W 50R I/O attenuator which will be connected to the input of the spectrum analyzer. I am confused a bit about the next things: 1. What is the difference between the two attenuation pads, T-pads and Pi-pads? Do Pi-pads shunt the signal to (...)
Perhaps stating the obvious now, but the pad size does not necessarily scale with the geometry per se. pad sizes can definitely be smaller than 100x80 . Are you in control over the bonding process in your lab? If there are constraints on e.g. ball size or wedge size, why not do larger pads on the silicon?
That pad probably has some baked-in design constraints as it's meant to be a power pad - might include clamps, decoupling and the output is supposed to be the same as the input only when applied a positive and fairly "stiff" voltage source. For analog signals that throw current, you want a pad that's "straight through" (no series (...)
Your schematic has wrongly connected the exposed pad to PGND, should be AGND. The connection between AGND and PGND is usually made by PCB copper or vias. To design it straightforward in PCB tool, you need specific features like start points or net connectors that can be placed in layout. As far as I remember, Eagle doesn't have it. SMD jumpers
We have no idea what is at the other end of the cable! If we assume (that is the best we can do) that the black wire is negative and red wire is positive, because that is a convention, from left to right they would be red then black. The other two appear to be RS232 data transmit and receive connections, if you have a DVM, solder the black and red
Hi, I am designing a 12 bit SAR ADC, for that I need to select minimum unit capacitor for the DAC, And I am using sqrt(KT/C)< LSB/2 formula to calculate the capacitor value. The obtained capacitor value minimises the thermal noise impact, what about the other parameters like mismatch etc. and how they affects the capacitor value? How to select t
Hi I am trying to make an SMPS using IRS2982SPBF ic. Input is 85-265Vac and output is 12V, 5A. The datasheet only says the maximum switching frequency. It is 320kHz. It is not saying anything about frequency selection. In some application notes they are using 40kHz and 65kHz. How can I select the switching frequency. Someone help me please
Connect them to ground, it is enough. ESD is normally at the direct input of the chip and builded into the pad between input & VDD/VSS, sometimes secondary ESD is implemented at the gates which are connected to pins and very sensitive. I am not an expert, but high frequency ESD model (I guess you need this) is capacitance to ground on circuit inpu
Hi guys, I was wondering that is there a standard for solder joint size of BGA chips or mostly your stencil defines it for you? for example what's the preferred solder ball size for 0.2*0.2 pad of a BGA chip?I ordered 0.3mm since it was their smallest available solderBall 156266
A gold wire bond 15um diameter about 7mm long bonded to from PCB pad to an IC Cu bump. How do I calculate the maximum current and frequency this wire bond can support?
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Hi, For the following nine SMD ceramic capacitors on a PCB, which capacitor would you say is most likely to suffer cracking? I am talking about cracking due to board flexion. This board gets screwed down to a metal heatsink, with a bit of thermal conductive rubber pad between board and heatsink.
Hi, Our contractor has done a prototype 60W offline single stage, PFC?d Flyback (240VAC). The primary FET is a metal tabbed TO220 and is directly screwed to an aluminium heatsink (no insulating pad used) . The heatsink is soldered into the PCB via two pins. The heatsink is obviously at drain node potential. We sent the PCB for testing wh