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41 Threads found on edaboard.com: Parasitic Package
Hello, I am designing an amplifier for high-impedance piezo sensors on a non-inverting configuration. Since this should be as low-noise/low-error as possible I was panning to do a guard ring around U1 input pin (3: V_IN+) and connect to 2:V_IN-. Is that a good idea? Should I remove ground plane bellow this input in order to minimize parasitic
If a differential mode is not considered, I'd prefer to use single varicap but lower cap. values.Because series connected varicaps wil have higher loss parasitics such as package bonding inductance, series resistances etc. so each parasitic will reduce the overall quality factor of the tank circuit.
If the chip was flip chip, but I want to further reduce the parasitic inductance. Any method I can do? Or the foundry has some method to reduce the inductance? Thanks.
Can anyone tell me where I can find the package parasitic of an IC (for ex.AD9361) to create IBIS model and to find its die capacitance . Thanks in advance.
Size Matters...... The smaller the package the better, but also routing and via placement will have a big effect on how the cap performs, the aim is to minimise parasitic inductance.....
a capacitor with a resistor in parallel is a good start. And don't forget to include any package parasitic reactances too
Nonlinear model does probably not take the package parasitics into account, therefore there might be some converge these small signal s-parameter model and nonlinear model, you should consider package parasitics.
Hi, I'd like to simulate the IO buffer. The chip needs input and output from FPGA. Chip package will be PGA. Could anyone tell me the capacitor between IO pads and FGPA in general? several pF or tens of pF, or something others? Thank you!
Pckage parasitics should added manually to die model.You can not define package parasitic components by trying particular circuit behaviour.
And, higher freq should have less parasitic parameters. So it is required to make small ic in package. - - - Updated - - - And, higher freq should have less parasitic parameters. So it is required to make small ic in package.
Size and cost are two that immediately come to mind. Capacitors also are only effective at filtering signals over a certain range, then their package parasitic dominate and they don't look like caps anymore. That's why you'll often see multiple caps on power pins of digital devices... like a 1 uF, 0.1 uF, 0.01 uF and ana 0.001 uF all in parallel.
I tend to agree about 1 - 2 GHz, but don't think there's a generally valid frequency number. You should put in parasitic package L and C values from manufacturer models and analyze the effect in a simulation. The usable frequency range depends on circuit impedance, gain and pin arrangement, particularly number of ground pins. DIP package (...)
Use "Load Pull Design Guide" 2011. Change the circuit parameters such as freq. ZL and ZS etc.. But 60 GHz is pretty high to claim an ampifier working at Class-E and that's why you should take all parasitic effects into account.(Layout,bonding,package etc.) Good luck..
Self resonance frequency of the coils and capacitors is an issue at higher additional to, realizing very small values-especially for coils- is pretty difficult. Quality factor is another issue,stray and body parasitic elements around the package are also serious constraints.. So, there are many reasons to use distributed components at
Hi All, I work in ic packaging layout. Recently, my client came out requesting for generating parasitic(RLC Parameters) of package pins i.e for solder balls. The package is wirebond package. Now, my doubt is what they do with RLC value of package pins? Just to create IBIS model for the (...)
The IBIS models can be used to characterize I/V output curves, rising/falling transition waveforms, and package parasitic information of the device, it is Input/Output Buffer Information Specification (IBIS), it helps designers predict the behavior of the pin connections , issues such as deformation of electronic signals as they travel on the PCB
Measuring the diode forward voltages of transistor respectively IC parasitic substrate junctions and leakage resistances between all three terminals would be a first step. Transistors can be identified by locating the current gain. If you don't have a DMM with transistor tester, a wet finger can do. As far as I know, Lambda didn't act as an IC v
Hi, I am working on design of LC VCO for 2.4 GHz. it is integrated with on-chip LDO and Buffer. 1. I would use 8 Pin Leadlless package. I need package parasitic model may be with approximate Values. if you have any paper then please give me. I will be thankfull to you. 2. also I am seeking help on design of buffer for (...)
What's the inductor value you are using for simulation? if you want accuracy, you may need some resistor in serias with this parasitic inductors. Maybe several mohms.
I have found (did an LNA project also) that the parasitics are going to affect the center frequency. The parasitic models will get you close but a little tweak is usually necessary. You can try adjusting the length of bond wires by moving the die to different places in the package. I assume you are using inductive degeneration. Also do you (...)