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81 Threads found on edaboard.com: Pcb Capacitance
I am design pcb layout for a PFC controller, and most of the suggested components size is 0603, and these value is not able to me as of the moment. Can I used 0805 or 1206 as a replacement to this 0603 components? what impact will these packaging difference may cause to my design? Or how will I compensate the difference? Can I just resize my trace
Crrs @ 24V doesn't give the effectiv capacitance, due to non-linear characteristic. You better use plateau charge from Qg graph. Expectable rise/fall time is about 100 ns according to my calculation, switching loss about 0.5 W, still moderate. Junction-to-ambient thermal resistance of 62 K/W demands for heat sink, e.g. a small pcb mounted type
All the component calculations, at least up to very high frequencies are identical. When the frequency is very high, the calculation stays the same but the effects of wire leg inductance and package capacitance may have to be taken into consideration. Heat sinking with SMD devices is normally achieved by soldering the tab to a copper area large e
Hi! My work is generally limited to power electronics and therefore I do not have much of experience with high frequency signal transmission. However, an application requires carrying 5 digital lines, from one portion of a 4-layer pcb to another portion. Length of traces will be approx 50mm. Frequency is 24MHz. 1. Do I need some special treatm
The only advantage of using a 3mm diameter hole is that you can use that hole to hold the pcb using screws. I think better than using a single 3mm hole is to use multiple vias in parallel. For the same area of a 3mm hole (7mm?) you can place 6 or even more small vias in parallel.
Apparently it's a dual variable capacitor, as used in many classical radio receivers. There seem to be four trimmer screws accessible through the pcb. In case of a superhet receiver (presume it is), the matching of both capacitors, respectively the capacitance ratio, is essential for receiver performance. What are you trying to modify?
I have never designed or built an IC, instead I buy ones that are already made. If I make an OTA with a 2N3904 and 2N3906 at the output then its output capacitance is 9.5pF plus at least 6pF for the pcb, before a load is added.
I have a pcb(test bench), which has "contacting device"(Socket) to holds the ICs(without soldering). The "contacting device"(Socket) consists from "pins". Effect of these "pins" I want to consider when simulating pcb in ADS. I have a graphics S21 and S11. And Self capacitance of pin: 0,47 pF Self Inductance of pin: 1.44 nH I have (...)
Hi, i'm developing some sensor based on RF principles (Reflectometry Sensor) First all have a (0,7mm*10mm)water sealed test pcb with two 2mm*10cm cooper strips with 1mm distance between them ( coplanar capacitor ), changing its value with surround moisture (variable coplanar capacitor ) This pcb dual striped probe is to measure moisture
HI all, I'm designing a multilayer pcb (12 layer ) and I decided to use layer 5 and 6 for power distribution. So the question is can I put one voltage(eg. 1V) on one plane(eg. L5) and then a second voltage(eg. 3.3V) on other plane(eg. L6) on top of it? OR i have to have GND plane In-between? Layer L4 and L7 are GND planes. Will be there
Hello, A Basic Question: Two paralle long coupled traces on a pcb have lets say mutual capacitance of Cx. Say one trace is open ended at one end and connected to GND Via at the the other end. Now if somehow I remove that GND connection at the top, will the two conductors will still have a mutual capacitance ? In a nutshell is (...)
I am using a 32.768kHz crystal for a ARM M0+ MCU. According to the specification, the crystal tolerence is 20PPM, and the loading capacitance is 12.5pF. To match the loading capacitance, a capacitor is connected between each of the crystal's terminal and the ground. By calculation (considered the pcb and MCU stray (...)
I allways be told that in order to achieve high performance of EMI&EMC, I should ensure the integrity of the grounding layer or large area of ground, would you please explain why it is? what thoery inside this?
Hi all, I am using High speed op-amp for DAC board, is there any routing contraint(Say cutout ground plane beneath IC Input Pin). please suggest some some layout constraint for this. Regards, Arunmaran
Hello, We are going to use the Meanwell HRPG-600-48 PSU (48V, 13A, Offline) to power our four 105W Buck LED drivers. (Iout=3A, Vout = 35V, fsw = 200KHz, CCM, non-synchronised) All the four LED drivers, when considered together, only have 80uF of input capacitance, due to pcb room constraints. Therefore, as you can imagine, most of the rippl
Hello, On a RF pcb (operation freq. : 6-8 GHz)with the stack up details as below, is there any precaution to be taken while routing RF CPWG vis-a-vis a 2 layer RF pcb, especially w.r.t. Cu that is present below all the RF traces in the layers below the top layer (particularly input and output traces of both active and passive MMICs) Stack up:
E.g. ground and power planes of a multi-layer pcb.
The shape of a real pcb trace will be most likely trapezodial, in so far the model is accounting the facts for better accuracy. But w = w1 is possible of course. You get 94.8 ohms differential impedance and 1.742 pF/inch. 15 cm corresponds to 6" respectively 6000 mils, by the way.
std cell coul not drive a pcb wire, or connection between two chips on a pcb. The IO are stronger buffers, and also special ESD structure. The bound pad are not mandatory, only the active pads.
It depends on a lot of factors. Needed impedance ratio adjustment, stray capacitance, losses in components and pcb traces. In general are losses higher for upper part of the matching frequency range. I do a lot of broadband antenna and RF filter matching, low power, compact, using 0402 components or smaller. Typical frequency range 300 MHz- 3 GHz.