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it sounds like you are using digital IOs. they are typically slow. why don't you use an analog IO? a barewire type of IO will do. at the pcb level, you will face a similar issue to capture signals at a fast rate. depending on your setup, of course.
the 5.5A ?Nominal? is for when its just on a single sided pcb, and with no thermal via?ing down to a heatsink. Yes, the point is well explained in data sheet footnote 6.
my self sivakumar from chennai, i have completed b tech, now i am plan to do m.tech, so i need part time job. i have completed certification course on electronics design automation. Contact number 8438377679.
Hi everyone, I'm using protel dxp for pcb design. I wanna know how to design coincident to IPC standards Exactly. is there a plug in or template or somthig like that to import these rules to protel? how do you call a design "STANDARD" and how prove it? I know there is IPC2221,IPC2223,...etc. but i think they are complicate and also i dont know
Capacitors should have low RF impedance of course but the pcb layout is more critical in your application. The capacitors can be selected from different manufacturers such as Murata, AVX, Johansson etc. ( Johansson is preferred regarding to my past experiences).But be careful for pcb layout and do an EM simulation with capacitors' models. (...)
I'm skipping the question if your stackup definition is reasonable and if blind vias can be produced with the intended substrate and prepreg dimensions. Your pcb has a via through all layers, it can of course connect layer 2 to 16.
If you are talking about pcb component side, regular pcb clearance and creepage rules for the respective operation voltage apply. Component metal cases have to be considered of course, obviously SMD components must not block throughole assembly. For the solder side, observe the restriction by the used solder method, e.g. selective wave solder.
Fresh CF campaign on offer you prototyping pcb. A bit different one. Protoboards on market are mostly for TH (Through Hole) components and off course it's also supported here. But you can combine it with other components since there is
Reverse engineering is always a possibility of course, Dave Jones has an excellent tutorial on that: I believe OP is looking for an automated way to do that however, which does not exist as far as I know. Yes you are correct t
hi, Lab view and Multi sim is a simulation tool and proteus is the pcb design tool as well as simulation for embedded code.i think in your syllabus simulation lab may be available (pspice,multisim or lab view) but in proteus you can write the program and run the simulation.better study proteus
hello, please compare to pcb eatching method with below points: 1)which is better? 2)which method is fast for max 5 pcb eatch? 3)cost? 4)quality? 5)can we do double layer? if anybody have UV light circuit design please share? 1) the quality in UV exposure method is superior to tonner transfer method. 2) tonner tran
A lot of what can be done and how depends upon what software you have. What pcb software and what Gerber software. Of course, it goes without saying that this should be done in the pcb CAD file first but sometimes they are not always available with legacy data.
Can anyone please guide me whether I should prefer single sided or double sided pcb design when designing an antenna on flexible substrate and for wearable purpose? Is there any advantage in terms of radiation pattern? ( i am looking for omni-directional pattern)
Hi All , i am a pcb designer having 7 yrs. EXP. I am looking for any Electronics Certification course(ONline or Distance) ,except IPC ( i know about it) pls help ,
i was an Eagle user for about five years in collage , i didn't had many problems back then with the light edition , as most of the circuits was simple and of course for education or hobby , but lately i required to do a pcb design job , and of course i chose eagle , as i have experience with it after i already have made a job with (...)
Here you can find the Spice model: At 4GHz on the top of using Spice or S-param files, the design of the pcb layout would play a very important role getting good isolation of the buffer amplifier.
What is your question(s)? Are you asking for a complete course on pcb design? I have no idea what "check both combined circuit dig & layout" means. Are you asking how to check your schematic against your layout? There is no single answer; all software is different.
The shape of a real pcb trace will be most likely trapezodial, in so far the model is accounting the facts for better accuracy. But w = w1 is possible of course. You get 94.8 ohms differential impedance and 1.742 pF/inch. 15 cm corresponds to 6" respectively 6000 mils, by the way.
You can have 3 layer boards. but can get problems as shown above. You need to either do an ORCAD course or read the help files regarding Gerber as being able to create them is quite a critical part of pcb design!!!
You cannot simulate lumped elements in Momentum because it doesn't recognize lumped lements.You can simulate pcb/substrate in Momentum by placing internal lumped elemets' ports then you should create a Momentum view in a schematic view with these internal connection ports ( of course input and output ports) then you will able to simulate whole circ