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310 Threads found on edaboard.com: Pcb Via
More information needed to estimate crosstalk: - pcb stackup, what's below the shown outer layer - Impedance of the attacked net
Hello all, in a production test equipment, on the tested pcbs ( DUT) there is a measurment of a RTC signal ( 32768hz nominal)... The signal is measured trough a keysight 53220A counter. The signal is routed from the tested pcb via a test probe trough a 1 meter long wiring harness -> contact switching matrix -> counter The (...)
Hi, I know one case which can cause such situation. If at least one of the vias has the value "Top-Middle-Bottom" in the "Stack mode" you will get what you have. Altium doesn't let you change diameter of vias which have the same diameter but different type of Stack mode using the pcb Inspector. A Top-Middle-Bottom via has 3 (...)
I Design Board With 5CEBA9F23C8N I choose AS Configuration for programming & EPCS128 After Develop pcb I start to program my board STEP1- Compile My Design in quartus 16.1(SIMPLE LED ON FOR TESTING) STEP2-CONVERT .SOF FILE TO .POF (FOR ACTIVE SERIAL EPCS128) STEP3-PROGRAM EPCS128 via PROGRAMMING(I SELECT ACTIVE MODE) STEP4- SUCESSFULLY E
I Design Board With 5CEBA9F23C8N I choose AS Configuration for programming & EPCS128 After Develop pcb I start to program my board STEP1- Compile My Design in quartus 16.1(SIMPLE LED ON FOR TESTING) STEP2-CONVERT .SOF FILE TO .POF (FOR ACTIVE SERIAL EPCS128) STEP3-PROGRAM EPCS128 via PROGRAMMING(I SELECT ACTIVE MODE) STEP4- SUCESSFULLY E
I Design Board With 5CEBA9F23C8N I choose AS Configuration for programming & EPCS128 After Develop pcb I start to program my board STEP1- Compile My Design in quartus 16.1(SIMPLE LED ON FOR TESTING) STEP2-CONVERT .SOF FILE TO .POF (FOR ACTIVE SERIAL EPCS128) STEP3-PROGRAM EPCS128 via PROGRAMMING(I SELECT ACTIVE MODE) STEP4- SUCESSFULLY EPC
I have build an c# application which connects to an embedded mcu based hardware via uart communication . I have used mcp2200 i am connecting the system as follows : mcu tx-rx --->max232----->db9 female connector ----> dm9 m connector on module pcb---->max232 on module pcb ---->mcp2200 on module pcb-----> usb connector on (...)
Hello everyone. I have a 4 layer pcb with high speed signals routed on layers 1 and 2, so I'd like to remove unused via pads on layers 3 and 4. If removing the via pads on layer 4 (bottom layer)...would the holes be properly plated or could it cause a manufacturability issue? Thanks!!
Is it possible to obtain low insertion loss in case of castellation pcb rf module LO output path transition? Or maybe use a pad and mimic RF surface mount RF IC? Currently I designed SIW transition, but pcb area used is a little too big - around 1x2 cm. S21 is good, an bandwidth is good, but any small gaps between pcbs worsens S11 alot. (...)
Don't use thermal spokes for RF pcb (L1 ground pad). I don't see an actual CPWG structure, rather a micro-strip with distant ground via fence, impedance is mostly that of the pure micro-strip. You could however taper the center line and reduce the ground separation towards the end. Or leave everything as is and put some series inductance for
The only advantage of using a 3mm diameter hole is that you can use that hole to hold the pcb using screws. I think better than using a single 3mm hole is to use multiple vias in parallel. For the same area of a 3mm hole (7mm?) you can place 6 or even more small vias in parallel.
I am doing single rank ddr3 routing in a 6 layer board with the following stackup:- Signal(L1) -> Gnd(L2) -> Signal(L3) -> Pwr(L4) -> Gnd(L5) -> Sig(L6) (I am using Saturn pcb Toolkit for calculations) via 1 (L1-3) via 2(L1-6) Height of via 12 mil[/td
Arduino mega +ssd1963 Problem Hi all.. I have designed a custom pcb with ATmega2560 for my project. Have a 4.3 inch tft on it With SSD1963 controller (16bit data bus). All the data and control lines are translated to 3.3 logic With 74ahc541 buffers. The connection from my pcb to display module is via a 40pin flat ribbon Cable. (...)
Hi I'm simulating a two layer pcb layout in ADS, which has an SMA connector to a coplanar transmission line. The figure shows how the ports are connected to the SMA connector. For simulation purpose I've removed the PTH via from the signal feed. In the EM setup the port P1 is made + and P4 is made - . Is this the correct way to model the ports
You cannot dog bone a 0.5mm BGA use via in pad and two to three HDI layers... or more if required. really? according to texas pcb guidelines, and others "At the 0.5mm pitch, there is sufficient space between pads to allow for a via that has the same dimension as the package ball pad. The pad and via are connected with
Hi, I am interested in learning Orcad and Altium. From scratch to high speed pcb design. Can some one teach me the same online via Skype and Team viewer? If interested, please reply with following details. 1) Timing 2) Fees details 3) Duration Regards Mohan.
Just so, hole size/pad size, sometimes you can go to 0.2/0.5 but that will depend on your pcb house, 0.3/0.65 or so is usually doable by most reasonable prototype shops. Do check the minimums with what your preferred pcb vendor supports, Wurth are very different to a generic Chinese low cost prototype company when it comes to minimum feature size
Hello together, i have problem with Altium Designer: The button "Favorite Interactive Routing via Size" is missing??? Normally it should be under Preferences->pcb Editor->Interactive Routing But there is nothing, ive attached some picture how it should be and how it is. Thanks for your help guys Marcus 129406[/ATTAC
Hi guys I have the laboratory experience of prototyping single 2-layer pcbs. Regarding the complexity of my new design and board size limitation, I am going to consider a 4-layer pcb. 127240 Here is my question: since Through Hole and Blind and Buried vias are parts of multi-layer pcbs, is it possible to implement
Hi all I'm using codevision with studio 7. I have a new pcb design that is connected to my pc port via a Olimex AVR ISP MK2 device. I checked the cables and all looks good. The code is from avr448 3 phase HV motor controller The problem is when I build all program files with codevision and program the chip I get back an error the mi


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