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19 Threads found on edaboard.com: Power Pad Layout
Limiting the current, but also ensuring that it spreads evenly so as to avoid hot-spotting and local power density related physical damage. Pullbacks (with salicide block) are the norm in ESD protection device design. They should be used on all pad-connected drains / sources. PMOS may not be self-survivable (i.e. its own D-S breakdown is low en
Hi I have a tpr file that it is a description of ALU.I want to make layout for it with cub library(cub.tdb file) in Tanner L-edit,but when I try to do this with SPR, it makes following error: SPR pad Route setup: pad route i/o signal layer and power layer must be different. please correct spr pad route (...)
Hi, I have a question of floorplan. In top chip layout when we define a core and its dimension in the command "floorplan", does it mean all the cells (IPs, standard cells, analog instances...) should be placed inside? There is only something like power rings, pad rings, wire connections outside the core? My design is mainly digital, (...)
You should properly add either a solder pad for your power/ground/output. Or use connectors.
You can do power planning...Route the vdd and gnd signals and interconnect them at all levels. At the top level use pad to connect to the top metal so that it is distributed equally and analize the IR drop.
Hi, i've this connector for power (2.5mm) that need to be inserted in a layout. the connector however have through-hole leads with oblong-shaped. in OrCAD layout, i tried to change the shape of the drill holes from round to oblong but cannot, the option is disabled... maybe because holes are definitely just for round-shaped. i then asked (...)
I'm design a test pad circuit to sense IF power coming out a differential driver to ADC. IF is 130MHz. Since the layout limitation balun is not able to used to convert differential to single-ended. A 25dB resistive pad is used to sense the power as attached. A pigtail will be connected between Tp502/504 to (...)
the core pad is only here to provide power to the core, so must be connected to the std-power ring instead the i/o power pad, that provide the power for the pad power ring.
Sorry, you didn't understand my answer: You need to connect the metal layer of your gnd! pin by a full metal connection (wire routing) to your std cell gnd! or power supply ring (or pad, or wherever you get your gnd! from). The 'subc' 'gnd!' tap is like an input, it has to be supplied by gnd!
Hello all, I am doing the layout of power supply pad for VDDPST supply (I have 2 supplies VDD and VDDPST of 1.8v and 3.2v). This pad is used to supply power to the IO's. For this i have used N-type diodes and one MOSCAP (NMOS cap) as shown in the screenshot. As per my understand, # When some -ve (...)
Hello all, I am doing the layout of power supply pad for VDDPST supply (I have 2 supplies VDD and VDDPST of 1.8v and 3.2v). This pad is used to supply power to the IO's. For this i have used N-type diodes and one MOSCAP (NMOS cap) as shown in the screenshot. As per my understand, # When some -ve (...)
hi... i am doing a design which has both digital and analog parts. after completing the layout and verification i added pads to the core module. I used digital pads from IOLIB_4M and analog pads from IOLIB_ANA_4M. Inside the pads i used there are global nets such as vdd3r! vdd3ro! gnd3r! gnd3ro! etc (...)
hi... i am doing a design which has both digital and analog parts. after completing the layout and verification i added pads to the core module. I used digital pads from IOLIB_4M and analog pads from IOLIB_ANA_4M. Inside the pads i used there are global nets such as vdd3r! vdd3ro! gnd3r! gnd3ro! etc (...)
Hi, I'm looking for some help in designing power amplifier for wimax. Precisely my question is about stability. Because I have to use Nitronex transistor NPT3015 I was utilizing following datasheet . When I perform small signal stability test (K, B1) I saw that in band 0.1 -5.1 the amplifier is not st
Hi, everyone. I am going to make a PCB with a wikinson power divider, which includes a SMT 100 Ohm resistor. For the 0402 resistor, I got the dimension of it from the data sheet, for example 1mm length and 0.5mm width. But there is no recommends of the PCB pads. My question is that what is the dimension of the pcb pads and spacing (...)
use 1M and 3M in routing the power lines. if noise is really an issue, put 2M in between them and connect it to the ground. The 3 parallel plates will act as a parasitic capacitor ( 1M to ground and 3M to ground). These parasitic caps is very useful in power lines as they bypass noise. Added after 4 minutes:[/siz
Hey all! In layout, should the width of a power(12V) metal path be wider, or narrower? (e.x. if a 2um width metal path(from pad to block) is acceptable in a 0.18um process) THX The current density of metal line(M1-M5) is about 1mA/um. You can choose the metal width of power line according to the principle. Usu
For power rings question, you also need to be carefully about the voltage drop from the pad. Also 1uA/1um can work for 0.18um, but for 0.13um, the metal is thinner.
which pad ? analog, digital, power, osc?